公开(公告)号：EP1299210A4

公开(公告)日：2004-11-17

申请号：EP01952272

申请日：2001-06-27

Applicant: IBM ,  FREUDENBERG NON WOVENS

Inventor： CHEN SHYNG-TSONG ,  CHUNG ALEX SIU KEUNG ,  DAVIS KENNETH M ,  HSU OSCAR KAI CHI ,  RODBELL KENNETH P

IPC: B24B37/26 ,  B24D13/14 ,  H01L21/304 ,  B24B1/00 ,  B23C3/28 ,  B24B37/04 ,  B24D18/00 ,  B26D7/01

CPC classification number: B24B37/26 ,  Y10T409/303808 ,  Y10T409/306608 ,  Y10T409/308624

Abstract: Grooves (70, 76, 78, & 80-82) are formed in a CMP pad (12) by positioning the pad (12) on a supporting surface (10) with a working surface (22) of the pad (12) in spaced relation opposite to a router bit (24) and at least one projecting stop member (33) adjacent to the router bit (24), an outer end portion of the bit (24) projecting beyond the stop (33). When the bit (24) is rotated, relative axial movement between the bit (24) and the pad (12) causes the outer end portion of the bit (24) to cut an initial recess in the pad (12). Relative lateral movement between the rotating bit (24) and the pad (12) then forms a groove (70) which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove (70) are limited by applying a vacuum to the working surface (22) of the pad (12) to keep it in contact with the stop member(s) (33). Different lateral movements between the bit (24) and the pad (12) are used to form a variety of groove patterns (76, 78, & 80-82), the depths of which are precisely controlled by the stop member(s) (33).

公开(公告)号：EP1341643A4

公开(公告)日：2004-06-09

申请号：EP01274075

申请日：2001-11-20

Applicant: IBM ,  FREUDENBERG NONWOVENS L P

Inventor： CHEN SHYNG-TSONG ,  RODBELL KENNETH P ,  HSU OSCAR KAI CHI ,  VANGSNESS JEAN ,  GILBRIDE DAVID S ,  BILLINGS SCOTT CLAYTON ,  DAVIS KENNETH

IPC: B24B37/24 ,  B24D3/28 ,  B24D11/00 ,  B24D13/14 ,  C08J5/14 ,  H01L21/304 ,  B24B37/04

CPC classification number: B24B37/24 ,  B24D3/28 ,  B24D11/008

Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers. The fibers may be separate, or in the form of a woven or non-woven web.

公开(公告)号：JP2004200684A

公开(公告)日：2004-07-15

申请号：JP2003413888

申请日：2003-12-11

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： CHEN SHYNG-TSONG ,  DALTON TIMOTHY J ,  DAVIS KENNETH M ,  HU CHAO-KUN ,  JAMIN FEN F ,  KALDOR STEFFEN K ,  KRISHNAN MAHADEVAIYER ,  KUMAR KAUSHIK ,  MICHAEL F ROFARO ,  SANDRA G MARUHOTORA

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L21/76849 ,  H01L21/76834 ,  H01L21/76847 ,  H01L21/76883 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide the structure of an integrated circuit having a logic/functional device layer and an interconnection layer above it. SOLUTION: This interconnection layer has a substrate, a conductive feature 122 in the substrate, and a cap 151 which is formed only above the conductive feature. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2003218109A

公开(公告)日：2003-07-31

申请号：JP2003003569

申请日：2003-01-09

Applicant: IBM

Inventor： DALTON TIMOTHY J ,  ANAND MINAKSHISUNDARAN B ,  ARMACOST MICHAEL D ,  CHEN SHYNG-TSONG ,  GATES STEPHEN M ,  GRECO STEPHEN E ,  KARECKI SIMON M ,  NITTA SATYANARAYANA V

IPC: H01L21/3205 ,  H01L21/768 ,  H01L23/52

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a metallic pattern on a low-dielectric constant substrate. SOLUTION: A hard mask including a lower hard mask layer 31 and an upper hard mask layer 20 is prepared. The upper hard mask layer 20 is a sacrifice layer of about 200 Å thick, which is preferably made of high-melting-point nitride. The sacrifice layer functions as a stop layer in the following CMP metal removal process. A resist layer is used to perform patterning. A protection layer 31t is formed on a hard mask, or a non-oxidized resist strip process is used, so as to avoid the damage of oxidization to the lower hard mask layer 31. COPYRIGHT: (C)2003,JPO

公开(公告)号：WO0202279A2

公开(公告)日：2002-01-10

申请号：PCT/US0120904

申请日：2001-06-29

Applicant: IBM ,  CHEN SHYNG TSONG ,  DAVIS KENNETH M ,  RODBELL KENNETH P

Inventor： CHEN SHYNG-TSONG ,  DAVIS KENNETH M ,  RODBELL KENNETH P

IPC: B24B37/26 ,  B24D13/12 ,  B24D13/14 ,  B24D18/00 ,  H01L21/304 ,  B24B37/04

CPC classification number: B24B37/26 ,  B24D18/00

Abstract: Grooves are formed in a CMP (12) pad by positioning the pad on a supporting surface with a working surface (22) of the pad in spaced relation opposite to a router bit (24) and at least one projecting stop member (33) adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s). The grooves may be formed in the polishing surface and/or the rear opposite surface of the pad and passages may be provided for interconnecting the rear grooves with the polishing surface or the front grooves. Grooves in the polishing surface may be provided with outlets through which a polishing slurry may flow while the polishing surface is in contact with a workpiece surface.

Abstract translation: 通过将衬垫定位在支撑表面上，通过衬垫的工作表面（22）以与router刨机钻头（24）和至少一个相邻的突出的止动构件（33）相对的间隔关系相反的方式在CMP（12） 到router刨机钻头，钻头的外端部分突出到挡块之外。 当钻头旋转时，钻头和垫之间的相对轴向移动导致钻头的外端部分切割垫中的初始凹陷。 旋转钻头和垫之间的相对横向运动然后形成凹槽，该凹槽横向地远离凹槽延伸并且具有与凹槽基本相同的深度。 钻头和垫之间的不同横向运动用于形成各种凹槽图案，其深度由止挡构件精确控制。 凹槽可以形成在抛光表面和/或抛光垫的后部相对表面中，并且通道可以设置用于将后部凹槽与抛光表面或前部凹槽互连。 抛光表面中的凹槽可以设置有出口，在抛光表面与工件表面接触的同时抛光浆料可以流过出口。

公开(公告)号：WO02100593A3

公开(公告)日：2003-06-05

申请号：PCT/US0143208

申请日：2001-11-20

Applicant: IBM ,  CHEN SHYNG-TSONG ,  RODBELL KENNETH P ,  HSU OSCAR KAI CHI ,  VANGSNESS JEAN ,  GILBRIDE DAVID S ,  BILLINGS SCOTT CLAYTON ,  DAVIS KENNETH

Inventor： CHEN SHYNG-TSONG ,  RODBELL KENNETH P ,  HSU OSCAR KAI CHI ,  VANGSNESS JEAN ,  GILBRIDE DAVID S ,  BILLINGS SCOTT CLAYTON ,  DAVIS KENNETH

IPC: B24B37/24 ,  B24D3/28 ,  B24D11/00 ,  B24D13/14 ,  C08J5/14 ,  H01L21/304 ,  B24B1/00 ,  B27N3/18

CPC classification number: B24B37/24 ,  B24D3/28 ,  B24D11/008

Abstract: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers. The fibers may be separate, or in the form of a woven or non-woven web.

Abstract translation: 一种抛光垫，其具有包含嵌入在通过聚合物前体的反应形成的基质聚合物中的纤维的主体。 纤维定义空隙，并且前体在反应完成之前基本上完全填充这些间隙。 衬垫在其抛光表面可以包括薄层的自由纤维。 至少一部分自由纤维的片段嵌入在聚合物和纤维的相邻体中。 纤维可以是分开的，或者是织造或非织造网的形式。

公开(公告)号：JP2005175479A

公开(公告)日：2005-06-30

申请号：JP2004353505

申请日：2004-12-07

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： CHEN SHYNG-TSONG ,  CHIRAS STEFANIE R ,  COLBURN MATTHEW EARL ,  DALTON TIMOTHY JOSEPH ,  HEDRICK JEFFREY CURTIS ,  HUANG ELBERT EMIN ,  KUMAR KAUSHIK A ,  LANE MICHAEL WAYNE ,  MALONE KELLY ,  NARAYAN CHANDRASEKHAR ,  NITTA SATYANARAYANA V ,  PURUSHOTHAMAN SAMPATH ,  ROSENBERG ROBERT ,  TYBERG CHRISTY S ,  YU ROY RONGQING

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L21/7682 ,  H01L21/76829 ,  H01L23/5222 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a structure which reduces the dielectric constant between conductive lines by providing an air dielectric. SOLUTION: In a multilevel microelectronic integrated circuit, air comprises a permanent line level dielectric, and an ultra-low-k material constitutes a via level dielectric. In the IC structure, air is supplied to the line level after removal of a sacrificial material by clean thermal decomposition and auxiliary diffusion of byproducts through porosities. Optionally, air is also included within porosities in the via level dielectric. By incorporating air into the extension produced in the invention, intralevel and interlevel dielectric values are minimized. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供通过提供空气电介质来降低导线之间的介电常数的结构。 解决方案：在多电平微电子集成电路中，空气包括永久线路电平介质，超低k材料构成通孔级电介质。 在IC结构中，通过清洁的热分解和副产物通过孔隙的辅助扩散除去牺牲材料之后，空气被提供给线路层。 任选地，空气也包括在通孔级电介质中的孔隙中。 通过将空气并入本发明中生产的延伸中，使层内和层间介电值最小化。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2001353656A

公开(公告)日：2001-12-25

申请号：JP2001127185

申请日：2001-04-25

Applicant: IBM

Inventor： CHEN SHYNG-TSONG ,  MICHAEL F ROFARO ,  SMITH WOODY RAY

IPC: B24B37/22 ,  B24B37/24 ,  B24B49/08 ,  B24D13/20 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a stacked type wafer polishing pad capable of changing its hardness. SOLUTION: A polishing pad assembly to be used in a chemical machinery polishing device having a polishing platen is provided. This polishing pad assembly includes a first pad disposed on the platen. The first pad is provided with a sealable enclosure having a flexible skin in which porous material is partially filled. A control mechanism is adapted to inject fluid into the enclosure, and extract fluid from the enclosure. Hardness of the first pad is changed in accordance with quantity of fluid in the enclosure. A second pad is disposed on the first pad.

公开(公告)号：CA2413803A1

公开(公告)日：2002-01-10

申请号：CA2413803

申请日：2001-06-27

Applicant: FREUDENBERG NON WOVENS ,  IBM

Inventor： DAVIS KENNETH M ,  HSU OSCAR KAI CHI ,  CHUNG ALEX SIU KEUNG ,  CHEN SHYNG-TSONG ,  RODBELL KENNETH P

IPC: B24B37/26 ,  B24D13/14 ,  H01L21/304 ,  B24B1/00

Abstract: Grooves (70, 76, 78, & 80-82) are formed in a CMP pad (12) by positionin g the pad (12) on a supporting surface (10) with a working surface (22) of the pad (12) in spaced relation opposite to a router bit (24) and at least one projecting stop member (33) adjacent to the router bit (24), an outer end portion of the bit (24) projecting beyond the stop (33). When the bit (24) i s rotated, relative axial movement between the bit (24) and the pad (12) cause s the outer end portion of the bit (24) to cut an initial recess in the pad (12). Relative lateral movement between the rotating bit (24) and the pad (1 2) then forms a groove (70) which extends laterally away from the recess and ha s a depth substantially the same as that of the recess. The depths of the initial recess and the groove (70) are limited by applying a vacuum to the working surface (22) of the pad (12) to keep it in contact with the stop member(s) (33). Different lateral movements between the bit (24) and the pad (12) are used to form a variety of groove patterns (76, 78, & 80-82), th e depths of which are precisely controlled by the stop member(s) (33).

公开(公告)号：DE60109170D1

公开(公告)日：2005-04-07

申请号：DE60109170

申请日：2001-06-29

Applicant: IBM

Inventor： CHEN SHYNG-TSONG ,  DAVIS M ,  RODBELL P

IPC: B24B37/26 ,  B24D13/12 ,  B24D13/14 ,  B24D18/00 ,  H01L21/304 ,  B24B37/04

Abstract: Grooves are formed in a CMP pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove are limited by applying a vacuum to the working surface of the pad to keep it in contact with the stop member(s). Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s). The grooves may be formed in the polishing surface and/or the rear opposite surface of the pad and passages may be provided for interconnecting the rear grooves with the polishing surface or the front grooves.