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    PROCESS FOR MAKING MULTILAYER INTEGRATED CIRCUIT SUBSTRATE
    1.
    发明专利
    PROCESS FOR MAKING MULTILAYER INTEGRATED CIRCUIT SUBSTRATE 未知

    公开(公告)号：DE3279492D1

    公开(公告)日：1989-04-06

    申请号：DE3279492

    申请日：1982-12-14

    Applicant: IBM

    Inventor： NAIR KRISHNA KUMAR ,  SNYDER KEITH ALAN

    IPC: C23C14/20 ,  H01L21/48 ,  H01L23/498 ,  H05K3/46 ,  H01L23/52

    Abstract: A process is provided for making a multilayer integrated circuit substrate having improved via connection. A first layer M1 of chrome-copper-chrome (19-20-21) is applied to a ceramic substrate (18) and the circuits etched. A polyimide layer (22) is then applied, cured, and developed and etched to provide via holes in the polyimide down to the M1 circuitry. The top chrome (21) is now etched to expose the M1 copper (20) in the via holes. A second layer M2 of copper-chrome (23-24) is evaporated onto the polyimide (22) at a high substrate temperature to provide a copper interface at the base of the vias having no visible grain boundaries and a low resistance. M2 circuitization is then carried out.

    5.
    发明专利
    未知

    公开(公告)号：DE68920469D1

    公开(公告)日：1995-02-23

    申请号：DE68920469

    申请日：1989-03-16

    Applicant: IBM

    Inventor： JONES ALAN LYTTON ,  SNYDER KEITH ALAN

    IPC: H05K7/20 ,  H01L23/057 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H01L23/498 ,  H01L23/18

    Abstract: An electronic package (10) including a first circuitized substrate (11) (e.g., printed circuit board), a second, flexible circuitized substrate (15) (e.g., polyimide), an electronic device (17) (semiconductor chip) and a metallic (e.g., aluminum) heat sink member (19) joined to the first substrate to provide a cover for the package's internal components. A predetermined quantity of liquid material (21) (e.g. wax or oil) is located between a defined surface of the chip and a corresponding internal surface of the heat sink member during assembly of the package, this material possessing a surface tension sufficient to create a suction force between the device and heat sink so as to elevate the device in a spaced position from (e.g., above) the first circuitized substrate during said assembly. Should a liquid material such as oil be utilized, this material remains in the liquid state during package operation to continuously provide the defined suction force sufficient to maintain the device at the elevated position. If a material such as wax is used, this material becomes solidified and remains so during package operation to thus maintain the device in elevated position by adhesion. Improved heat dissipation for the package and ease of assembly thereof is thus possible.

    7.
    发明专利
    未知

    公开(公告)号：DE68920469T2

    公开(公告)日：1995-07-20

    申请号：DE68920469

    申请日：1989-03-16

    Applicant: IBM

    Inventor： JONES ALAN LYTTON ,  SNYDER KEITH ALAN

    IPC: H05K7/20 ,  H01L23/057 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H01L23/498 ,  H01L23/18

    Abstract: An electronic package (10) including a first circuitized substrate (11) (e.g., printed circuit board), a second, flexible circuitized substrate (15) (e.g., polyimide), an electronic device (17) (semiconductor chip) and a metallic (e.g., aluminum) heat sink member (19) joined to the first substrate to provide a cover for the package's internal components. A predetermined quantity of liquid material (21) (e.g. wax or oil) is located between a defined surface of the chip and a corresponding internal surface of the heat sink member during assembly of the package, this material possessing a surface tension sufficient to create a suction force between the device and heat sink so as to elevate the device in a spaced position from (e.g., above) the first circuitized substrate during said assembly. Should a liquid material such as oil be utilized, this material remains in the liquid state during package operation to continuously provide the defined suction force sufficient to maintain the device at the elevated position. If a material such as wax is used, this material becomes solidified and remains so during package operation to thus maintain the device in elevated position by adhesion. Improved heat dissipation for the package and ease of assembly thereof is thus possible.

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