公开(公告)号：DE3769484D1

公开(公告)日：1991-05-29

申请号：DE3769484

申请日：1987-01-16

Applicant: IBM

Inventor： BABU SURYSDEVARA VIJAYAKUMAR ,  HERRMANN WILLIAM FREDERICK ,  HOFFARTH JOSEPH GERARD ,  MARKOVICH VOYA ,  WILEY ROBERT TAYLOR

IPC: C23C18/30 ,  C23C18/36 ,  H05K3/08 ,  H05K3/18 ,  H05K3/26

公开(公告)号：DE3870378D1

公开(公告)日：1992-05-27

申请号：DE3870378

申请日：1988-08-02

Applicant: IBM

Inventor： BABU SURYADEVARA VIJAYAKUMAR ,  BUI VU QUANG ,  HOFFARTH JOSEPH GERARD ,  WELSH JOHN ANDREW

IPC: B29C65/48 ,  B32B15/08 ,  C08J5/12 ,  C09J5/02 ,  C23C8/36 ,  H05K3/38 ,  H05K3/46 ,  C23F4/00

Abstract: A method for improving the adhesion of a polymer such as an epoxy resin to an electrolytic copper surface wherein the copper surface to be adhered is exposed to gas plasma containing a fluorohydrocarbon.

公开(公告)号：DE68916068D1

公开(公告)日：1994-07-21

申请号：DE68916068

申请日：1989-02-03

Applicant: IBM

Inventor： HOFFARTH JOSEPH GERARD ,  WILEY JOHN PENNOCK

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

公开(公告)号：DE69117381D1

公开(公告)日：1996-04-04

申请号：DE69117381

申请日：1991-07-01

Applicant: IBM

Inventor： CHANG CHI SHIH ,  HOFFARTH JOSEPH GERARD ,  MARKOVICH VOYA RISTA ,  SNYDER KEITH ALAN ,  WILEY JOHN PENNOCK

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00

公开(公告)号：DE3681077D1

公开(公告)日：1991-10-02

申请号：DE3681077

申请日：1986-05-28

Applicant: IBM

Inventor： BABU SURYADEVARA VIJAYAKUMAR ,  HOFFARTH JOSEPH GERARD ,  WELSH JOHN ANDREW

IPC: B28B11/12 ,  B23B35/00 ,  H05K3/00 ,  H05K3/26 ,  H05K13/00

Abstract: The method for cleaning the cuts (24) machined into a workpiece (22) such as a printed electric circuit board, includes the steps of coating the cutting instrument (36) such as a drill bit, with a liquid tracer prior to the cutting operation. During the cutting operation, the liquid tracer becomes mixed with material such as an electrically insulating binder layer (50) disposed, e.g. between opposed metal plates (46, 48) of the workpiece (22). Any smear (52) of the insulating layer (50) upon exposed metal surfaces of the cut (24) contains elements of chemical compounds used in the tracer. After extraction of the cutting instrument (36) from the workpiece (22), the latter is placed in a plasma reactor (26) wherein the metal surfaces are etched to remove any smears and debris (52) of the insulation material found on the exposed metal surfaces. The tracer elements, such as deuterium and phosphorus are monitored in the effluent plasma of the reactor (26) to determine when the cleaning of the cuts (24) in the workpiece (22) is completed.

公开(公告)号：DE69117381T2

公开(公告)日：1996-09-26

申请号：DE69117381

申请日：1991-07-01

Applicant: IBM

Inventor： CHANG CHI SHIH ,  HOFFARTH JOSEPH GERARD ,  MARKOVICH VOYA RISTA ,  SNYDER KEITH ALAN ,  WILEY JOHN PENNOCK

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00

公开(公告)号：DE68916068T2

公开(公告)日：1995-01-05

申请号：DE68916068

申请日：1989-02-03

Applicant: IBM

Inventor： HOFFARTH JOSEPH GERARD ,  WILEY JOHN PENNOCK

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

公开(公告)号：DE3676107D1

公开(公告)日：1991-01-24

申请号：DE3676107

申请日：1986-03-19

Applicant: IBM

Inventor： BABU SURYADEVARA VIJAYAKUMAR ,  HOFFARTH JOSEPH GERARD ,  KNOLL ALLAN ROBERT ,  MLYNKO WALTER EUGENE ,  REMBETSKI JOHN FRANCIS

IPC: H01L21/302 ,  C09K13/00 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/311 ,  C23F1/12 ,  B44C1/22 ,  C23C4/04