公开(公告)号：JP2002076037A

公开(公告)日：2002-03-15

申请号：JP2001202574

申请日：2001-07-03

Applicant: IBM

Inventor： RAMESHU R KODONAANII ,  MATIENZO LUIS J ,  SON K TORAN

IPC: C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide an electronic module having improved adhesion at the interface between a passivation and an underfill of a chip. SOLUTION: The surface of a passivation of a chip is chemically reformed to a sufficient depth so that a set passivation is more reactive. The reformed surface is processed with a polyamide. During reflow of solder joint of an electronic module under heat, the reformed passivation reacts with the polyamine at an amine functional group, After the electronic module is underfilled with the polymer material, the polyamine on the surface of the passivation reacts with the underfill material while the underfill material sets. Since the amine acts as a chemical fixing part for both the reformed passivation and the underfill material, the provided electronic module is less fragile.

公开(公告)号：JP2000281820A

公开(公告)日：2000-10-10

申请号：JP2000065480

申请日：2000-03-09

Applicant: IBM

Inventor： RAMESHU R KODONAANII ,  MATIENZO LUIS J ,  SON K TORAN

IPC: C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide an electronic module having an improved adhesion at the boundary of a passivation with an under-fill of a chip. SOLUTION: This electronic module is obtained by chemically modifying the surface of a passivation 5 until a sufficient depth so as to enrich the reactivity of the cured passivation 5. The modified surface is treated with a polyamine. During a reflow of a soldering of the electronic module by heating, the modified passivation 5 reacts with the polyamine with its amine functional group. After under-filling the electronic module with a polymer material, the polyamine on the surface of the passivation 5 reacts with the under-fill material 15 while the under-fill material 15 is cured. Since the amine acts as a chemical fixing position to both cured passivation 5 and the under-fill material 15, the obtained electronic module is tough.