公开(公告)号：JPH11274223A

公开(公告)日：1999-10-08

申请号：JP1940299

申请日：1999-01-28

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレイション

Inventor： CUTTING LAWRENCE R ,  JOHN GERALD GAUDIELO ,  MATIENZO LUIS J ,  NIHIR MOHAN MAADESHWO

IPC: H01L21/60 ,  H01L21/607 ,  H01L23/498 ,  H05K3/24 ,  H05K3/32

CPC classification number: H01L24/85 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/48644 ,  H01L2224/48744 ,  H01L2224/48844 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/15798 ,  H01L2924/20105 ,  H01L2924/20752 ,  H01L2924/20753 ,  H05K3/244 ,  H05K3/328 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To form a metal surface capable of connection which receives conducting wiring, by sticking a thin second metal layer on a first metal layer, and heating the first and the second metal layers up to a specified temperature for a specified time. SOLUTION: A substrate 11 with a circuit is formed of proper dielectric material (organic insulating material like epoxy glass) on which a wiring layer 13 composed of copper or the like is formed. A first metal layer 14 composed of palladium of 5 microinches thick is formed on a wiring layer 13. A second thin metal layer 15 of gold (50-200 Å thick) which is different from the first metal layer 14 is arranged on the first metal layer 14. The first metal layer 14 and the second metal layer 15 which are composed of palladium and gold are heated for one hour, up to 180 deg.C. When heating, hydrogen molecules captured by a palladium layer is energized by heat and discharged in air through a gold layer. A wire 17 of wire bond is connected with the first metal layer 14 through the second thin metal layer 15.

Abstract translation: 要解决的问题：通过在第一金属层上粘附细的第二金属层，并且将第一和第二金属层加热到规定温度一定时间，形成能够接收导电布线的金属表面。 解决方案：具有电路的基板11由适当的电介质材料（诸如环氧玻璃的有机绝缘材料）形成，其上形成有由铜等构成的布线层13。 在布线层13上形成由5微英寸厚的钯构成的第一金属层14.与第一金属层14不同的金（50-200厚）的第二薄金属层15布置在第一金属 将由钯和金构成的第一金属层14和第二金属层15加热1小时，最高达180℃。 当加热时，由钯层捕获的氢分子被加热并通过金层在空气中排出。 线接合线17通过第二薄金属层15与第一金属层14连接。

公开(公告)号：JP2001308480A

公开(公告)日：2001-11-02

申请号：JP2001054795

申请日：2001-02-28

Applicant: IBM

Inventor： ADVOCATE JR GERALD G ,  DONS FRANCIS J JR ,  MATIENZO LUIS J ,  KASCHAK RONALD A ,  JOHN S KURESUGE ,  VAN HART DANIEL C

IPC: C23C18/18 ,  C25D7/00 ,  H01L21/60 ,  H01L23/498 ,  H01L23/522 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide an electronic structure having a conductive plating layer where adhesion of plating is enhanced. SOLUTION: A substrate having a metal sheet in a dielectric layer is used. The metal sheet contains a metal, e.g. copper. An opening, e.g. a blind via, is made in the substrate by laser drilling passing through a part of the dielectric layer and the metal sheet. Surface (blind surface) beneath the opening includes a metal protrusion formed by laser drilling and the metal protrusion is integrated with the blind surface. The metal protrusion contains the metal of the metal sheet and at least one component from the dielectric layer. Subsequently, the metal protrusion is etched to form a metal interlock structure integral with a part of the blind surface. A conductive metal is stuck into the opening including the metal interlock structure by plating.

公开(公告)号：JP2002076037A

公开(公告)日：2002-03-15

申请号：JP2001202574

申请日：2001-07-03

Applicant: IBM

Inventor： RAMESHU R KODONAANII ,  MATIENZO LUIS J ,  SON K TORAN

IPC: C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide an electronic module having improved adhesion at the interface between a passivation and an underfill of a chip. SOLUTION: The surface of a passivation of a chip is chemically reformed to a sufficient depth so that a set passivation is more reactive. The reformed surface is processed with a polyamide. During reflow of solder joint of an electronic module under heat, the reformed passivation reacts with the polyamine at an amine functional group, After the electronic module is underfilled with the polymer material, the polyamine on the surface of the passivation reacts with the underfill material while the underfill material sets. Since the amine acts as a chemical fixing part for both the reformed passivation and the underfill material, the provided electronic module is less fragile.

公开(公告)号：JP2000281820A

公开(公告)日：2000-10-10

申请号：JP2000065480

申请日：2000-03-09

Applicant: IBM

Inventor： RAMESHU R KODONAANII ,  MATIENZO LUIS J ,  SON K TORAN

IPC: C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To provide an electronic module having an improved adhesion at the boundary of a passivation with an under-fill of a chip. SOLUTION: This electronic module is obtained by chemically modifying the surface of a passivation 5 until a sufficient depth so as to enrich the reactivity of the cured passivation 5. The modified surface is treated with a polyamine. During a reflow of a soldering of the electronic module by heating, the modified passivation 5 reacts with the polyamine with its amine functional group. After under-filling the electronic module with a polymer material, the polyamine on the surface of the passivation 5 reacts with the under-fill material 15 while the under-fill material 15 is cured. Since the amine acts as a chemical fixing position to both cured passivation 5 and the under-fill material 15, the obtained electronic module is tough.

公开(公告)号：CA2291568A1

公开(公告)日：2000-09-19

申请号：CA2291568

申请日：1999-12-02

Applicant: IBM

Inventor： KODNANI RAMESH R ,  TRAN SON K ,  MATIENZO LUIS J

IPC: C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  C09J179/02 ,  H01L23/18

Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

公开(公告)号：MY127692A

公开(公告)日：2006-12-29

申请号：MYPI20000649

申请日：2000-02-22

Applicant: IBM

Inventor： KODNANI RAMESH R ,  MATIENZO LUIS J ,  TRAN SON K

IPC: C08G18/00 ,  C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  H01L23/02 ,  H01L23/24 ,  H01L23/29 ,  H01L23/31

Abstract: AN ELECTRONIC MODULE HAVING ENHANCED ADHESION AT THE CHIP PASSIVATION AND UNDERFILL INTERFACE IS DISCLOSED. THE SURFACE OF THE CHIP PASSIVATION IS CHEMICALLY MODIFIED TO A SUFFICIENT DEPTH SUCH THAT THE CURED PASSIVATION IS MORE REACTIVE. THE MODIFIED SURFACE IS TREATED WITH A POLYAMINE PREFERABLY HAVING A CYCLIC AMINE EXTENDING FROM A PREFERABLY ALIPHATIC BACKBONE. DURING REFLOW OF THE SOLDER JOINTS OF THE ELECTRONIC MODULE BY HEATING, THE MODIFIED PASSIVATION REACTS WITH THE POLYAMINE AT THE AMINE FUNCTIONALLY. FOLLOWING UNDERFILL OF THE ELECTRONIC MODULE WITH A POLYMERIC MATERIAL, PREFERABLY AN EPOXY RESIN,THE POLYAMINE ON THE SURFACE OF THE PASSIVATION REACTS WITH THE UNDERFILL MATERIAL DURING CURING OF THE UNDERFILL MATERIAL. THE RESULTING ELECTRONIC MODULE IS MORE ROBUST SINCE THE AMINE ACTS AS A CHEMICAL ANCHORING SITE FOR BOTH THE MODIFIED PASSIVATION AND THE UNDERFILL MATERIAL. A METHOD OF ASSEMBLING AN ELECTRONIC MODULE UTILIZING THE POLYAMINE TREATMENT AT THE CHIP AND WAFER LEVEL IS ALSO DISCLOSED.(FIG. 1)

公开(公告)号：HK1031276A1

公开(公告)日：2001-06-08

申请号：HK01102059

申请日：2001-03-21

Applicant: IBM

Inventor： KODNANI RAMESH R ,  MATIENZO LUIS J ,  TRAN SON K

IPC: C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L

Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.