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1.Method of rendering noble metal conductive composition non-wettable by solder 失效
Title translation: 使贵金属导电组合物不能被焊料润湿的方法公开(公告)号:US3401126A
公开(公告)日:1968-09-10
申请号:US46503565
申请日:1965-06-18
Applicant: IBM
Inventor: MILLER LEWIS F , SPIELBERGER RICHARD K
CPC classification number: C04B41/009 , B23K35/224 , C04B41/5116 , C04B41/88 , C04B2111/00844 , H01B1/16 , H01L24/81 , H01L2224/13111 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01056 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K1/092 , H05K3/3452 , H05K2201/10674 , H05K2201/2081 , C04B41/5022 , C04B41/5025 , C04B41/5122 , C04B35/00 , H01L2924/00
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2.Ceramic composition,improved electronic devices employing same,and method of fabrication 失效
Title translation: 陶瓷组合物,使用其的改进的电子器件以及制造方法公开(公告)号:US3495996A
公开(公告)日:1970-02-17
申请号:US3495996D
申请日:1966-05-13
Applicant: IBM
Inventor: DELANEY RONALD A , SPIELBERGER RICHARD K
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公开(公告)号:US3365631A
公开(公告)日:1968-01-23
申请号:US47181065
申请日:1965-07-14
Applicant: IBM
Inventor: DELANEY RONALD A , SPIELBERGER RICHARD K
CPC classification number: C04B35/465 , H01B1/08 , H01B3/02 , H01G4/12 , H01G4/1209 , H01G7/028 , H01L21/00
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4.
公开(公告)号:CA878554A
公开(公告)日:1971-08-17
申请号:CA878554D
Applicant: IBM
Inventor: DELANEY RONALD A , SPIELBERGER RICHARD K
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