公开(公告)号：JP2009253290A

公开(公告)日：2009-10-29

申请号：JP2009089338

申请日：2009-04-01

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： STEEN STEVEN ERIK ,  FEGER CLAUDIUS ,  NANCY C RABIANKA

IPC: H01L21/60 ,  G01B11/00

CPC classification number: H01L23/544 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73104 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2224/05599

Abstract: PROBLEM TO BE SOLVED: To provide a method and system for determining alignment data of structures on a wafer or a chip. SOLUTION: The method and the system are provided for determining alignment data of structures on a work piece such as a wafer or a chip coated with an over bump applied material like resin or a film, for example, and using the data to align the wafer or the chip in a following operation such as dicing or joining. One of data for alignment is generated by identifying a location of the structure by varying the depth of a focus upon a work piece to determine an approximately maximum value of an SNR from an image captured by optical scanning. The SNR above a threshold can be employed. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于确定晶片或芯片上的结构的对准数据的方法和系统。 解决方案：该方法和系统被提供用于确定诸如晶片或芯片上的结构的对准数据，例如涂覆有诸如树脂或膜的超凸起涂覆材料，并且使用数据 在以下操作中对准晶片或芯片，例如切割或接合。 用于对准的数据之一通过通过改变工件上的焦点的深度来识别结构的位置而产生，以从通过光学扫描捕获的图像确定SNR的近似最大值。 可以使用高于阈值的SNR。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：GB2516011A

公开(公告)日：2015-01-14

申请号：GB201311815

申请日：2013-07-02

Applicant: IBM

Inventor： SCHMIDT MARKUS ,  EICKELMANN HANS-JUERGEN ,  KELLMANN RUEDIGER ,  KUEHL HARTMUT ,  HOVEL HAROLD JOHN ,  STEEN STEVEN ERIK

IPC: H01L31/052 ,  H01L31/0232

Abstract: The invention relates to concentrated photovoltaics for thin film solar cell devices. The thin film solar cell device 100 comprises a substrate 10 with one or more thin film radiation absorbers 12 and a cover 20 which covers the substrate and the absorbers. Mounted to this is an integrated optical system 14, comprising at least one optical element 16 used for concentrating the light onto the solar cell. The optical element 16 and the corresponding radiation absorbers 12 are aligned with respect to their optical axis 24, such that an incoming radiation 22 is directed onto the radiation absorber 12 by the optical system 14. The device can have a second optical system 18 which is arranged between the first optical element and the radiation absorbers. The first optical system may be integrated at a top surface of the cover medium, and can comprise of a lens array, whilst the second optical system can comprise a light guide. The second optical element can be integrated with the top of the radiation absorbing device.