公开(公告)号：GB2536383B

公开(公告)日：2017-02-01

申请号：GB201610765

申请日：2014-11-26

Applicant: IBM

Inventor： STEFANO OGGIONI ,  THOMAS J BRUNSCHWILER ,  GERD SCHLOTTIG

IPC: H01L23/36 ,  H01L25/065

Abstract: Manufacturing of flip-chip type assemblies is provided, and includes forming one or more contact elements of electrically conductive material on a carrier surface of at least one chip carrier, providing a restrain structure around the contact elements, depositing solder material on the contact elements and/or on one or more terminals of electrically conductive material on a chip surface of at least one integrated circuit chip, and placing the chip with each terminal facing corresponding contact elements. Further, the method includes soldering each terminal to the corresponding contact element by a soldering material, the soldering material being restrained during a soldering of the terminals to the contact elements by the restrain structure, and forming one or more heat dissipation elements of thermally conductive material on the carrier surface for facing the chip surface displaced from the terminals, where the one or more heat dissipation elements are free of any solder mask.

公开(公告)号：ITUA20164817A1

公开(公告)日：2017-12-30

申请号：ITUA20164817

申请日：2016-06-30

Applicant: IBM

Inventor： STEFANO OGGIONI ,  BRUNSCHWILER THOMAS ,  GERKE SEBASTIAN

公开(公告)号：GB2536383A

公开(公告)日：2016-09-14

申请号：GB201610765

申请日：2014-11-26

Applicant: IBM

Inventor： STEFANO OGGIONI ,  THOMAS J BRUNSCHWILER ,  GERD SCHLOTTIG

IPC: H01L23/36 ,  H01L25/065

Abstract: A solution relating to electronic devices of flip-chip type is proposed. Particularly, an electronic device (200,300;400;700;800) of flip-chip type comprises at least one chip carrier (110;805) having a carrier surface (135;835), the carrier comprising one or more contact elements (140s,140p;740s,740p;840s,840p) of electrically conductive material on the carrier surface, at least one integrated circuit chip (105;705) having a chip surface (120;720), the chip comprising one or more terminals (125s,125p;725s,725p) of electrically conductive material on the chip surface each one facing a corresponding contact element, solder material (150;750) soldering each terminal to the corresponding contact element, and restrain means (210s,210p,310;410sl,410sd,410p;790s,790p;890s,890p) around the contact elements for restraining the solder material during a soldering of the terminals to the contact elements, wherein the carrier comprises one or more heat dissipation elements (205s,205p;785s,785p;885s,885p) of thermally conductive material on the carrier surface facing the chip surface displaced from the terminals, the dissipation elements being free of any solder mask.