STRUCTURE OF PELLICLE OF X-RAY MASK AND MANUFACTURE THEREOF

    公开(公告)号:JP2001028334A

    公开(公告)日:2001-01-30

    申请号:JP2000172901

    申请日:2000-06-09

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a film and hard spacer type pellicle structure, where the area of X-ray mask is increased, the film and fitting material of an X-ray mask is enlarged in range, and precision in manufacture is improved. SOLUTION: An oxide layer is patterned on bulk spacer materials 12 and 13, having a thickness equal to the gap between an X-ray mask 1 and the oxide which is to be patterned. The oxide on the bulk spacer materials 12 and 13 prevents conversion of a part of wafer that functions as a spacer to the etching characteristics which differ from the bulk spacer materials 12 and 13 via the exposed surface of the wafer of bulk spacer materials 12 and 13. The wafer of exposed bulk spacer materials 12 and 13 functions as a spacer and is converted into a depth which protects the edge part. Then the oxide is removed. A film is made to adhere to the entire surface of the bulk spacer materials 12 and 13. The bulk wafer is removed as far as the converted part by utilizing the different etching characteristics which is provided.

    COLOR FILTER FOR FLAT PANEL DISPLAY AND ITS PRODUCTION

    公开(公告)号:JP2000172188A

    公开(公告)日:2000-06-23

    申请号:JP31087599

    申请日:1999-11-01

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To make sub-pixel elements free of the effect of subsequent treatment of sub-pixel members and to attain high pixel density. SOLUTION: Areas 10, 12, 15 of red, green and blue color sub-pixel elements are successively formed on a transparent substrate 1 in the entire pixel area 9. After the formation of the separate color sub-pixel elements and before the formation of the next sub-pixel elements, the separate sub-pixel elements and the pixel area are coated with layers 11, 14, 16 of a protective transparent material. The protective layers make the sub-pixel elements free of the effect of subsequent treatment of sub-pixel members when the condition of high temperature curing, a curing agent or curing treatment is used and the advantages of producibility, reliability, yield, cost and throughput are attained.

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