公开(公告)号：JP2000124572A

公开(公告)日：2000-04-28

申请号：JP11767999

申请日：1999-04-26

Applicant: IBM

Inventor： DONALD RENE WALL ,  SURINIVASA S N REDI

IPC: H05K1/09 ,  C04B41/52 ,  C04B41/89 ,  C12N15/34 ,  C23C16/06 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To optimize the amount of non-metal added to a paste by mixing a filler material with either a titania or zirconia related to a paste for a via of a ceramic substrate and external feature. SOLUTION: A via 2 is formed inside a substrate 1 comprising three layers of ceramic material layer, and related to the via 2, a paste is formed from either titania or zirconia or both 2A and any one of a plurality of standard fillers such as alumina, sub-micron alumina, etc., or a plurality of objects 2B, molybdenum 2C, glass 2D, etc. A surface layer with the bias 2 exposed is plated with a dry process nickel plating or its alloy ion. Thus, the amount of non-metal added to a paste is optimized.