公开(公告)号：JP2002297836A

公开(公告)日：2002-10-11

申请号：JP2001093452

申请日：2001-03-28

Applicant: IBM

Inventor： TERADA HIROTO ,  TAKAYOSHI JUNJI ,  NOTO HIROKAZU

IPC: G06Q10/00 ,  G06Q50/00 ,  G06Q50/26 ,  G07B1/02 ,  G07C9/00 ,  G07C11/00 ,  G06F17/60

Abstract: PROBLEM TO BE SOLVED: To provide an acceptance system, acceptance processing method and acceptance processing program capable of easily and promptly conducting acceptance processing. SOLUTION: The acceptance system 10 includes an acceptance terminal 12, a server 14 and a receptionist terminal 16. The acceptance system 10 is provided in a branch office 11. The acceptance terminal 12, the server 14 and the receptionist terminal 16 are connected to one another to communicate through a communication network 18. The acceptance terminal 12 is installed in a reception desk. A server 14 is a computer capable of storing a number of visit data.

公开(公告)号：JP2009081439A

公开(公告)日：2009-04-16

申请号：JP2008245676

申请日：2008-09-25

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SCHMIDT ROGER R ,  YAMADA YASUHARU ,  TAKAYOSHI JUNJI ,  PORTER DONALD W ,  TSUKAMOTO TAKASHI

IPC: H05K7/20 ,  F25B1/00 ,  G06F1/20 ,  H05K7/18

CPC classification number: H05K7/20827

Abstract: PROBLEM TO BE SOLVED: To provide a vapor-compression heat exchange system for progressing the cooling of an electronics rack. SOLUTION: A system 300 includes an evaporator coil 340 mounted to an outlet cover 330 fixed at the air outlet side of a rack 310 by a hinge, and refrigerant inlet and outlet plenums and an expansion valve 341 all of which are also mounted to the outlet cover and in fluid communication with the evaporator coil. The evaporator coil includes at least one heat exchange tube and a plurality of fins extending therefrom. Respective connect couplings connect the inlet and outlet plenums in fluid communication with a vapor-compression unit 350 which includes a compressor 351 and a condenser 352 disposed separate from the outlet door cover. The vapor-compression unit exhausts heat from a refrigerant circulating therethrough. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供用于进行电子机架的冷却的蒸汽压缩热交换系统。 解决方案：系统300包括：蒸发器盘管340，其安装到通过铰链固定在齿条310的空气出口侧的出口盖330;以及制冷剂入口和出口增压室以及全部也安装在其上的膨胀阀 到出口盖并与蒸发器盘管流体连通。 蒸发器盘管包括至少一个热交换管和从其延伸的多个翅片。 各个连接联轴器连接入口和出口压气室与蒸汽压缩单元350流体连通，蒸汽压缩单元350包括与出口门盖分离设置的压缩机351和冷凝器352。 蒸汽压缩单元从循环的制冷剂排出热量。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2010072993A

公开(公告)日：2010-04-02

申请号：JP2008240689

申请日：2008-09-19

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SCHMIDT ROGER R ,  TAKAYOSHI JUNJI ,  TSUKAMOTO TAKASHI ,  IMAI MASAAKI ,  INOUE YOSHINORI ,  KOUCHI MINORU ,  FUNATSU MASAYOSHI

IPC: G06F1/20 ,  H05K7/18 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and method for promoting cooling of an electronic apparatus rack. SOLUTION: A cooling apparatus for an electronic apparatus including a semiconductor device includes an evaporator which contains a refrigerant and makes the refrigerant vaporize under pressure lower than ambient pressure to generate a chilled refrigerant, a condenser which is communicated with the evaporator through a bypass line and reproduces the refrigerant from vapor of the refrigerant, and a circulating pump and a line which supply the cooled refrigerant to a heat exchange area of the electronic apparatus, cause heat exchange with an air flow that passes through the semiconductor device at a high temperature side of the electronic apparatus and return the refrigerant after the heat exchange to the condenser, and the pressure of the refrigerant is maintained lower than the ambient pressure in the area where heat is exchanged with the air flow. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于促进电子设备机架的冷却的装置和方法。 解决方案：一种用于包括半导体器件的电子设备的冷却装置，包括含有制冷剂并使制冷剂在低于环境压力的压力下蒸发以产生冷冻制冷剂的蒸发器，冷凝器通过一个蒸发器与蒸发器连通 旁路管路并从制冷剂的蒸气中再生制冷剂，循环泵和将冷却的制冷剂供给到电子设备的热交换区域的管线，与通过半导体器件的空气流高度交换 并将热交换后的制冷剂返回到冷凝器，并且制冷剂的压力保持低于与空气流交换热量的区域中的环境压力。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JPH0964552A

公开(公告)日：1997-03-07

申请号：JP20955195

申请日：1995-08-17

Applicant: IBM

Inventor： TSUKAMOTO TAKASHI ,  TANAKA KATSUSHI ,  TAKAYOSHI JUNJI

IPC: H05K5/02 ,  E02D27/34 ,  E04H9/02

Abstract: PROBLEM TO BE SOLVED: To provide an antiseismic supporting structure which can absorb the influence of an earthquake on equipment installed on a fixed floor and can be applied to already existing equipment without requiring any expensive installation cost. SOLUTION: An antiseismic supporting structure has a fixed section 1 which is fixed to a fixed floor, a traveling section 10 which is connected to the section 1 and travels in an arbitrary direction in parallel with the fixed floor, and an equipment connecting section 20 which is connected to the section 10 and equipment installed on the fixed floor. When the shock of an earthquake is very weak, a caster fixing section 27 prevents the movement of the equipment by fixing the caster 30 of the equipment. When the shock of the earthquake is weak or intermediate, the resonance of the equipment is prevented by moving the traveling section 10 in a direction parallel to the fixed floor and, when the shock of an earthquake is strong, the vibration of the section 10 is absorbed by means of a shock absorbing means attached to the outer periphery 4 of the fixed section 1.