公开(公告)号：JPH1093014A

公开(公告)日：1998-04-10

申请号：JP16586397

申请日：1997-06-23

Applicant: IBM

Inventor： ANILKUMAR CHINAPURASADDO BERT ,  ROY HARVEY MAGUNASON ,  THOMAS RICHARD MILLER ,  BOYA RISUTA MARCOVICI ,  CARLOS J SANBASETSUTEI ,  STEFAN LEO TEISUDEERU

IPC: H05K3/38 ,  C23C18/16 ,  H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K3/18 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To reliably form a flip chip and wire bonding pads on a component structure having an organic surface and circuit board having an organic surface and considerably increase the device density on the circuit board. SOLUTION: A liq. layer contg. a surfactant is fed to a catalytic layer on a board (station 482), and the wet board is treated in a electroless liq. bath tank (station 484) in which the surfactant level is approximately determined by measuring the surface tension of the electroless liq. to adjust the quantity of the surfactant to be fed into the tank, based on the measured surface tension.