公开(公告)号：JP2001332558A

公开(公告)日：2001-11-30

申请号：JP2001098341

申请日：2001-03-30

Applicant: IBM

Inventor： CARLOS J SANBASETSUTEI ,  STEVEN H BOECHER ,  PETER S LOCKE ,  JUDITH M RABINO ,  SUUN-CHEON SEO

IPC: H01L21/288 ,  H01L21/28 ,  H01L21/3205 ,  H01L23/52 ,  H01L23/522

Abstract: PROBLEM TO BE SOLVED: To provide improved structure where a single layer having the integrity of a liner, and the electrical continuity between a related level and another metal one is given. SOLUTION: The structure of a semiconductor has a semiconductor dielectric material 1 having an opening. A first material 15 for backing the opening is composed of M, X, and Y. In this case, the M is selected from a group consisting of cobalt and nickel, the X is selected from a group consisting of tungsten and silicon, and the Y is selected from a group consisting of phosphor and boron. A second material 20 fills a backed dielectric material.

公开(公告)号：JPH1093014A

公开(公告)日：1998-04-10

申请号：JP16586397

申请日：1997-06-23

Applicant: IBM

Inventor： ANILKUMAR CHINAPURASADDO BERT ,  ROY HARVEY MAGUNASON ,  THOMAS RICHARD MILLER ,  BOYA RISUTA MARCOVICI ,  CARLOS J SANBASETSUTEI ,  STEFAN LEO TEISUDEERU

IPC: H05K3/38 ,  C23C18/16 ,  H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K3/18 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To reliably form a flip chip and wire bonding pads on a component structure having an organic surface and circuit board having an organic surface and considerably increase the device density on the circuit board. SOLUTION: A liq. layer contg. a surfactant is fed to a catalytic layer on a board (station 482), and the wet board is treated in a electroless liq. bath tank (station 484) in which the surfactant level is approximately determined by measuring the surface tension of the electroless liq. to adjust the quantity of the surfactant to be fed into the tank, based on the measured surface tension.