公开(公告)号：JPH10209221A

公开(公告)日：1998-08-07

申请号：JP545198

申请日：1998-01-14

Applicant: IBM

Inventor： PIERSON MARK VINCENT ,  THURSTON BRICE YOUNGS JR

IPC: H01L21/60 ,  H01L23/367 ,  H01L23/44 ,  H01L23/473 ,  H01L23/482 ,  H01L25/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To provide a structure for facilitating edge mounting of a chip onto a board or another chip. SOLUTION: The integrated circuit package derives enhanced mechanical rigidity and electrical reliability. Heat dissipation capacity is increased by bonding the edge of the integrated circuit chip 11 onto a board 16. Bonding is effected by forming a solder or a conductive adhesive between a bonding/ contact pad 15 on the board and a metallization structure extending at least into the limited facing region on the major surface of a chip. A thermal conductive material contained in a cap can impart an additional distributed support for the chip through combination of viscosity and density for imparting buoyancy of the chip.

公开(公告)号：JPH10214862A

公开(公告)日：1998-08-11

申请号：JP582098

申请日：1998-01-14

Applicant: IBM

Inventor： PIERSON MARK VINCENT ,  THURSTON BRICE YOUNGS JR

IPC: H01L21/60 ,  H01L23/50 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L25/10 ,  H01L25/11

Abstract: PROBLEM TO BE SOLVED: To provide an integrated circuit package which has an increased mechanical strength and electrical reliability. SOLUTION: An integrated circuit chip 13 is bonded to a chip stack 12, and the chip stack 12 is bonded to another integrated circuit chip 11. At this point, an adhesive agent 15 is provided on a major surface of the chip 13 and between the major surface and a metallization structure 14 transversely extended across an edge of the chip 14. A metallization structure 11A is provided between a bonding pad on the chip 11 and the metallization structure 14 of the chip 13.