公开(公告)号：CA980920A

公开(公告)日：1975-12-30

申请号：CA164187

申请日：1973-02-19

Applicant: IBM

Inventor： RYAN WILLIAM J SR ,  THOMA NANDOR G ,  SCHIRMER EDWARD F ,  TOLLEY JAMES H ,  WILDER DONALD L

IPC: H01L21/00 ,  H01L21/683

Abstract: A system for handling an oriented array of objects, such as integrated circuit chips, includes a fixture in which the chips are held in place by vacuum means. A chip placement tube is capable of reciprocal motion normal to the plane of the fixture to move a chip unidirectionally from its position in the array for placement on a substrate. The system further includes means for positioning a substrate precisely with respect to a chip in the array to allow its direct placement from the array. This fixture and system allows the precise orientation and alignment of semiconductor chips in a wafer to be maintained for laser dicing and chip positioning on a substrate without requiring reorientation. When combined with testing and inspection apparatus and a suitable memory, the system further allows handling and processing of chips to be minimized.