公开(公告)号：DE69119241T2

公开(公告)日：1996-11-21

申请号：DE69119241

申请日：1991-08-01

Applicant: IBM

Inventor： LOGAN JOSEPH ,  RUCKEL RAYMOND ,  TOMPKINS ROBERT ,  WESTERFIELD ROBERT

IPC: B23Q3/15 ,  H01L21/683 ,  H02N13/00 ,  H01L21/00

Abstract: An electrostatic chuck 8 assembly includes, from top to bottom: a top multilayer ceramic insulating layer 10; an electrostatic pattern layer 12 having a conductive electrostatic pattern 16 disposed on a multilayer ceramic substrate; a multilayer ceramic support layer 20; and, a heat sink base 30 having a backside cooling channels machined therein. Layers 12, 12 and 20 are bonded together using multilayer ceramic techniques and the heatsink base 30 is brazed to the bottom of the multilayer ceramic support layer 20.

公开(公告)号：DE69119241D1

公开(公告)日：1996-06-05

申请号：DE69119241

申请日：1991-08-01

Applicant: IBM

Inventor： LOGAN JOSEPH ,  RUCKEL RAYMOND ,  TOMPKINS ROBERT ,  WESTERFIELD ROBERT

IPC: B23Q3/15 ,  H01L21/683 ,  H02N13/00 ,  H01L21/00

Abstract: An electrostatic chuck 8 assembly includes, from top to bottom: a top multilayer ceramic insulating layer 10; an electrostatic pattern layer 12 having a conductive electrostatic pattern 16 disposed on a multilayer ceramic substrate; a multilayer ceramic support layer 20; and, a heat sink base 30 having a backside cooling channels machined therein. Layers 12, 12 and 20 are bonded together using multilayer ceramic techniques and the heatsink base 30 is brazed to the bottom of the multilayer ceramic support layer 20.