公开(公告)号：DE2966253D1

公开(公告)日：1983-11-10

申请号：DE2966253

申请日：1979-06-18

Applicant: IBM

Inventor： OKTAY SEVGIN ,  TORGERSEN GERARD JOSEPH ,  WONG ALEXANDER CHUN-BONG

IPC: H05K7/20 ,  H01L23/42 ,  H01L23/427 ,  H01L23/44 ,  H01L23/473 ,  H01L23/46

Abstract: A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned so that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels.