公开(公告)号：DE19801247A1

公开(公告)日：1999-07-29

申请号：DE19801247

申请日：1998-01-15

Applicant: IBM

Inventor： DIEBOLD ULRICH DIPL ING ,  TORREITER OTTO DIPL ING ,  WIEDEMANN HANS

IPC: G01R31/28 ,  H01L21/60 ,  H01L21/68 ,  G01R31/26

Abstract: A device for the precise alignment of a semi-conductor chip (3) with controlled collage chip connection pads (2) comprises a substrate (1) and a template stop (4). An Independent claim is included for a process for the precise alignment of (3) onto (1) by application of the template (4) to act as a stop for the connection pads (2).

公开(公告)号：DE69020155T2

公开(公告)日：1995-12-07

申请号：DE69020155

申请日：1990-09-15

Applicant: IBM

Inventor： DIEBOLD ULRICH DIPL ING ,  RIEGLER JOACHIM DIPL ING ,  ROST PETER DIPL ING ,  SCHMIDT MANFRED DIPL PHYS ,  TORREITER OTTO DIPL ING ,  VERWEGEN PETER DIPL ING ,  WEILAND DAWN ,  WENDEL DIETER DIPL ING

IPC: G01R31/317 ,  G06F11/27 ,  G06F11/26

公开(公告)号：DE69020155T4

公开(公告)日：1996-06-27

申请号：DE69020155

申请日：1990-09-15

Applicant: IBM

Inventor： DIEBOLD ULRICH DIPL ING ,  RIEGLER JOACHIM DIPL ING ,  ROST PETER DIPL ING ,  SCHMIDT MANFRED DIPL PHYS ,  TORREITER OTTO DIPL ING ,  VERWEGEN PETER DIPL ING ,  WEILAND DAWN ,  WENDEL DIETER DIPL ING

IPC: G01R31/317 ,  G06F11/27 ,  G06F11/26

公开(公告)号：DE69020155D1

公开(公告)日：1995-07-20

申请号：DE69020155

申请日：1990-09-15

Applicant: IBM

Inventor： DIEBOLD ULRICH DIPL ING ,  RIEGLER JOACHIM DIPL ING ,  ROST PETER DIPL ING ,  SCHMIDT MANFRED DIPL PHYS ,  TORREITER OTTO DIPL ING ,  VERWEGEN PETER DIPL ING ,  WEILAND DAWN ,  WENDEL DIETER DIPL ING

IPC: G01R31/317 ,  G06F11/27 ,  G06F11/26