公开(公告)号：DE19801247A1

公开(公告)日：1999-07-29

申请号：DE19801247

申请日：1998-01-15

Applicant: IBM

Inventor： DIEBOLD ULRICH DIPL ING ,  TORREITER OTTO DIPL ING ,  WIEDEMANN HANS

IPC: G01R31/28 ,  H01L21/60 ,  H01L21/68 ,  G01R31/26

Abstract: A device for the precise alignment of a semi-conductor chip (3) with controlled collage chip connection pads (2) comprises a substrate (1) and a template stop (4). An Independent claim is included for a process for the precise alignment of (3) onto (1) by application of the template (4) to act as a stop for the connection pads (2).

公开(公告)号：DE19801247B4

公开(公告)日：2005-06-30

申请号：DE19801247

申请日：1998-01-15

Applicant: IBM

Inventor： DIEBOLD ULRICH ,  TORREITER OTTO ,  WIEDEMANN HANS

IPC: G01R31/28 ,  H01L21/60 ,  H01L21/68 ,  G01R31/26 ,  H01L21/66

Abstract: A method and device are presented for precise alignment of a semiconductor chip on a substrate which, in a simple and cost-effective way, permit accurate alignment of individual chips on a substrate to be ensured.