公开(公告)号：CA2291568A1

公开(公告)日：2000-09-19

申请号：CA2291568

申请日：1999-12-02

Applicant: IBM

Inventor： KODNANI RAMESH R ,  TRAN SON K ,  MATIENZO LUIS J

IPC: C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  C09J179/02 ,  H01L23/18

Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

公开(公告)号：MY127692A

公开(公告)日：2006-12-29

申请号：MYPI20000649

申请日：2000-02-22

Applicant: IBM

Inventor： KODNANI RAMESH R ,  MATIENZO LUIS J ,  TRAN SON K

IPC: C08G18/00 ,  C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  H01L23/02 ,  H01L23/24 ,  H01L23/29 ,  H01L23/31

Abstract: AN ELECTRONIC MODULE HAVING ENHANCED ADHESION AT THE CHIP PASSIVATION AND UNDERFILL INTERFACE IS DISCLOSED. THE SURFACE OF THE CHIP PASSIVATION IS CHEMICALLY MODIFIED TO A SUFFICIENT DEPTH SUCH THAT THE CURED PASSIVATION IS MORE REACTIVE. THE MODIFIED SURFACE IS TREATED WITH A POLYAMINE PREFERABLY HAVING A CYCLIC AMINE EXTENDING FROM A PREFERABLY ALIPHATIC BACKBONE. DURING REFLOW OF THE SOLDER JOINTS OF THE ELECTRONIC MODULE BY HEATING, THE MODIFIED PASSIVATION REACTS WITH THE POLYAMINE AT THE AMINE FUNCTIONALLY. FOLLOWING UNDERFILL OF THE ELECTRONIC MODULE WITH A POLYMERIC MATERIAL, PREFERABLY AN EPOXY RESIN,THE POLYAMINE ON THE SURFACE OF THE PASSIVATION REACTS WITH THE UNDERFILL MATERIAL DURING CURING OF THE UNDERFILL MATERIAL. THE RESULTING ELECTRONIC MODULE IS MORE ROBUST SINCE THE AMINE ACTS AS A CHEMICAL ANCHORING SITE FOR BOTH THE MODIFIED PASSIVATION AND THE UNDERFILL MATERIAL. A METHOD OF ASSEMBLING AN ELECTRONIC MODULE UTILIZING THE POLYAMINE TREATMENT AT THE CHIP AND WAFER LEVEL IS ALSO DISCLOSED.(FIG. 1)

公开(公告)号：HK1031276A1

公开(公告)日：2001-06-08

申请号：HK01102059

申请日：2001-03-21

Applicant: IBM

Inventor： KODNANI RAMESH R ,  MATIENZO LUIS J ,  TRAN SON K

IPC: C08J7/04 ,  C08G73/06 ,  C08J7/00 ,  H01L21/312 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L

Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.