公开(公告)号：US3411122A

公开(公告)日：1968-11-12

申请号：US52053466

申请日：1966-01-13

Applicant: IBM

Inventor： SCHILLER JULIUS M ,  TURETZKY MELVIN N

IPC: H01B3/30 ,  H01C1/02 ,  H01C7/00 ,  H01C17/02

CPC classification number: H01C1/02 ,  H01B3/306 ,  H01B3/307 ,  H01C7/00 ,  H01C17/02 ,  Y10T29/49087

公开(公告)号：CA973979A

公开(公告)日：1975-09-02

申请号：CA150293

申请日：1972-08-24

Applicant: IBM

Inventor： LANGSTON PERRY R JR ,  TURETZKY MELVIN N

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/03 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/46

Abstract: A process for forming a glass interconnection package for semiconductor chips including the steps of depositing a first layer of glass material on a supporting substrate and then heating the layer in a first gaseous ambient which is soluble in the glass material. Immediately thereafter, the first gaseous ambient is replaced by a second gaseous ambient which is insoluble in the glass material and the glass layer is heated and then cooled down to ambient atmosphere.

公开(公告)号：CA978278A

公开(公告)日：1975-11-18

申请号：CA150295

申请日：1972-08-24

Applicant: IBM

Inventor： GREENSTEIN BERNARD ,  LANGSTON PERRY R JR ,  NARKEN BERNT ,  TURETZKY MELVIN N

IPC: H05K3/46 ,  H01L20060101 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/538 ,  H05K3/00 ,  H01L

公开(公告)号：CA813498A

公开(公告)日：1969-05-20

申请号：CA813498D

Applicant: IBM

Inventor： SCHILLER JULIUS M ,  TURETZKY MELVIN N