公开(公告)号：US3663194A

公开(公告)日：1972-05-16

申请号：US3663194D

申请日：1970-05-25

Applicant: IBM

Inventor： GREENSTEIN BERNARD ,  LANGSTON PERRY R JR ,  NARKEN BERNT ,  SUNNERS BRIAN

IPC: C03C3/089 ,  G02B6/10 ,  G02B6/12 ,  G02B6/43 ,  G02F3/00 ,  H03F17/00 ,  C03C29/00 ,  C03C27/00

CPC classification number: G02B6/12002 ,  C03C3/089 ,  G02B6/10 ,  G02B6/43 ,  G02F3/00 ,  H03F17/00

Abstract: Multilayer opto-electronic module structures and their method of fabrication. Alternate layers of light conducting material and light isolating material are formed on a substrate and on each other. Isolating bars are formed in a predetermined pattern within the layers of light conducting material to define optical channels or chambers. Suitable illuminating and detecting means may be included within the channels using the isolating materials as electrical conductors so as to perform logic, memory and display functions.

Abstract translation: 多层光电模块结构及其制造方法。 导光材料和光隔离材料的交替层形成在基板上并且彼此之间。 在导光材料层内以预定图案形成隔离条以限定光学通道或室。 合适的照明和检测装置可以使用隔离材料作为电导体包括在通道内，以便执行逻辑，存储和显示功能。

公开(公告)号：CA1007052A

公开(公告)日：1977-03-22

申请号：CA159876

申请日：1972-12-27

Applicant: IBM

Inventor： LANGSTON PERRY R JR ,  TUMMALA RAO R ,  WILSON DONALD M

IPC: G02F1/1339 ,  G09F9/307 ,  H01J9/26

公开(公告)号：CA973979A

公开(公告)日：1975-09-02

申请号：CA150293

申请日：1972-08-24

Applicant: IBM

Inventor： LANGSTON PERRY R JR ,  TURETZKY MELVIN N

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/03 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/46

Abstract: A process for forming a glass interconnection package for semiconductor chips including the steps of depositing a first layer of glass material on a supporting substrate and then heating the layer in a first gaseous ambient which is soluble in the glass material. Immediately thereafter, the first gaseous ambient is replaced by a second gaseous ambient which is insoluble in the glass material and the glass layer is heated and then cooled down to ambient atmosphere.

公开(公告)号：CA981799A

公开(公告)日：1976-01-13

申请号：CA150294

申请日：1972-08-24

Applicant: IBM

Inventor： JOHNSON ALFRED H ,  LANGSTON PERRY R JR ,  SUNNERS BRIAN

IPC: H01L23/48

公开(公告)号：CA978278A

公开(公告)日：1975-11-18

申请号：CA150295

申请日：1972-08-24

Applicant: IBM

Inventor： GREENSTEIN BERNARD ,  LANGSTON PERRY R JR ,  NARKEN BERNT ,  TURETZKY MELVIN N

IPC: H05K3/46 ,  H01L20060101 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/538 ,  H05K3/00 ,  H01L