公开(公告)号：JPH06334021A

公开(公告)日：1994-12-02

申请号：JP3869794

申请日：1994-03-09

Applicant: IBM

Inventor： TAIBAA RUISU BAUAA ,  UIRIAMU ARUBAATO KABUARIEERU ,  DEEBUITSUDO KIISU GURIIN ,  JIYON PIITAA KARIDEISU ,  DEEBUITSUDO KURAIDO RINERU

IPC: B65G47/90 ,  B28D5/00 ,  H01L21/677 ,  H01L21/687 ,  H05K13/02 ,  H01L21/68

Abstract: PURPOSE: To provide a transfer device which is capable of setting a laser bar at a prescribed position in a following process, wherein the semiconductor laser bar formed of crystal material which is fragile and liable to chipping is cleaved in an ultra-high vacuum to form a facet of high safety. CONSTITUTION: A cleavage jaw 14 is pressed against a semiconductor laser bar 100 on a cleavage platform 102 to form a required cleavage plane. Then, the laser bar 100 is pinched between magnetic transfer tips 58 and 60 by the side edges other than the cleavage plane and carefully transferred at a prescribed position in a following process.