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公开(公告)号:FR2395580A1
公开(公告)日:1979-01-19
申请号:FR7816945
申请日:1978-05-29
Applicant: IBM
Inventor: HEMPSTEAD ROBERT D , KRONGELB SOL , NEPELA DANIEL A , THOMPSON DAVID A , VALSTYN ERICH P
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公开(公告)号:FR2342547A1
公开(公告)日:1977-09-23
申请号:FR7700649
申请日:1977-01-05
Applicant: IBM
Inventor: AINSLIE NORMAN G , HEMPSTEAD ROBERT D , TAN SWIE-IN , VALSTYN ERICH P
IPC: C22C38/00 , C23C14/40 , G11B5/147 , G11B5/31 , H01F10/14 , H01F41/14 , H01F41/18 , H01F10/02 , G11B5/62
Abstract: Iron-silicon is sputtered onto a substrate to be used for a magnetic recording head from a target containing 4% to 7% of silicon with a substrate bias between -2.5 and -60 volts, anode-cathode spacing of about 1/2 to about 2 inches, a deposition rate of greater than 150A/min, a substrate temperature above 250 DEG C, an argon pressure above 10 microns, and a single film thickness greater than 0.4 micron, a laminated film thickness greater than 0.05 micron, and R.F. input power above 8 watts/in2.
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公开(公告)号:CA815190A
公开(公告)日:1969-06-10
申请号:CA815190D
Applicant: IBM
Inventor: VALSTYN ERICH P , WALLIS CHRISTOPHER N
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