公开(公告)号：MY103063A

公开(公告)日：1993-04-30

申请号：MYPI19880167

申请日：1988-02-19

Applicant: IBM

Inventor： CHESTER ASBURY HEATH ,  SAMUEL THOMAS DUSI ,  KENNETH LYNN MANNS ,  GERMAN ESCOBAR ,  RICHARD DANA KIRK ,  JAY HENRY NEER ,  BILLY WILLIAM MOORE ,  RICHARD WILLIAM SHAW ,  VICTOR VASYL ZADEREJ

IPC: G06F1/16 ,  G06F13/40 ,  G12B17/02 ,  H01R4/64 ,  H05K1/11 ,  H05K7/14 ,  H05K9/00

Abstract: IN A PERSONAL COMPUTER, A PORTION OF THE FRAME THROUGH WHICH CONNECTIONS ARE MADE BETWEEN EACH I/O FEATURE CARD WITHIN THE FRAME A PERIPHERAL DEVICE EXTERNAL TO THE FRAME IS FORMED OF POLYCARBONATE AND PLATED INTERNALLY WITH COPPER AND NICKEL TO PROVIDE AN ENHANCED A.C. GROUND STRUCTURE, COUPLED TO PROCESSOR SIGNAL GROUND VIA A CAPACITOR. A.C. GROUND IS AT GROUND POTENTIAL FOR ALTERNATING CURRENTS OF HIGH ENOUGH FREQUENCY TO RADIATE. A.C. GROUND MAY BE AT ANY DIRECT CURRENT POTENTIAL. THE OPENINGS THROUGH WHICH CONNECTIONS ARE MADE HAVE U-SHAPED CHANNEL SECTIONS, AND MATING I/O BRACKETS OF STAINLESS STEEL HAVE U-SHAPED CROSS SECTIONS AND ARE RECEIVED WITHIN THE CHANNEL SECTIONS. SPRING LOADED CONTACTS AROUND THE PERIPHERY OF THE BRACKETS ENGAGE AND MAKE ELECTRICAL CONTACT WITH THE ADJACENT SURFACES OF THE CHANNEL SECTIONS EVERY ONE-HALF INCH TO MINIMIZE ELECTROMAGNETIC RADIATION THROUGH THE OPENINGS IN THE FRAME. (FIG. 8)