公开(公告)号：CA1067972A

公开(公告)日：1979-12-11

申请号：CA278023

申请日：1977-05-10

Applicant: IBM

Inventor： BRAUN ROLAND J ,  VON VOSS WILLIAM D

IPC: H05K1/11 ,  H01L23/50 ,  H01R4/02 ,  H05K1/18 ,  H05K3/34 ,  H05K1/04

Abstract: ELECTRICAL CONNECTION STRUCTURE AND METHOD Surface connections of electrical component leads to circuit substrate lands are made with split sleeves on the lead ends, adjusted for contact with the lands, and soldered in position to join leads, sleeves, and lands.

公开(公告)号：CA1073275A

公开(公告)日：1980-03-11

申请号：CA280006

申请日：1977-06-07

Applicant: IBM

Inventor： SKARVINKO EUGENE R ,  VON VOSS WILLIAM D

IPC: H05K3/34 ,  B23K1/00 ,  B23K1/015 ,  B23K35/38 ,  B23K1/02

Abstract: VAPOR BONDING METHOD Components, printed circuit board assemblies and the like to be interconnected by soldering are appropriately fluxed and placed in an atmosphere of a saturated vapor derived from a heat transfer liquid medium having a boiling point above the melting point of the solder. The heat transfer medium is chosen to have a solubility parameter compatible with the solubility parameter of the flux to eliminate the need for subsequent flux cleaning. An alternate embodiment includes a fatty acid in the heat transfer medium, which under some circumstances can eliminate the need to apply flux to the assembly being soldered.