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    2.
    发明专利
    未知

    公开(公告)号：DE1765582B1

    公开(公告)日：1971-12-16

    申请号：DE1765582

    申请日：1968-06-14

    Applicant: IBM

    Inventor： SELLEY GERARD ,  ANTHONY TOTTA PAUL ,  WALD GEORGE

    IPC: C23C14/02 ,  C23C14/54 ,  C23C15/00

    Abstract: 1,158,888. Sputtering and vapour deposition. INTERNATIONAL BUSINESS MACHINES CORP. June 4, 1968 [June 15, 1967], No.26534/68. Heading C7F. An apparatus for sputter-cleaning surface portions of an article and evaporating material on to the cleaned surface portions comprises an ionization chamber with means for evacuating the chamber and means for inserting an ionizable gas therein, article support means mounted in said container for holding at least one article for successive sputter-cleaning and evaporation operations and arranged to be negatively biased during sputtering with respect to shield means located on opposite sides of said article support means arranged to shield said article support means from undesired sputtering and evaporation operations, said shield means being located within the "dark space" created during sputtering, heating means for heating the articles to a desired temperature level to permit evaporated material to be deposited on cleaned surface portions of said article, and material evaporation means for evaporating material on to the cleaned surface portions of said articles. In the embodiment shown in Fig. 1, part-spherical section 32 constitutes the holding means for articles 42, and the two shields are constituted by apertured sheets 22 and 74, which latter has in its apertures quartz plates 76 which permit radiation from heater assembly 78 to heat the articles. A tungsten holder 98 bearing the material 96 to be evaporated is heated by A. C. source 105. A specific type of substrate holder is described, and the deposition of Cr-Cu-Au on a semi-conductor is given as an example.

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