公开(公告)号：DE69222905D1

公开(公告)日：1997-12-04

申请号：DE69222905

申请日：1992-07-14

Applicant: IBM

Inventor： CHRISTIE FREDERICK R ,  PAPATHOMAS KOSTAS ,  WANG DAVID W

IPC: C08G18/76 ,  C08G73/06 ,  C08L79/04 ,  C09J175/00 ,  C09J175/04 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  C08G73/00

Abstract: Compositions containing bisphenol M-dicyanate, prepolymer thereof, or mixtures thereof, and 4,4'-ethylidene bisphenoldicyanate, prepolymer thereof or mixtures thereof; and filler having maximum particle size of 20 microns and being substantially free of alpha particle emissions. The compositions are useful in forming interconnection structures between an integrated semiconductor device (1) and a carrier substrate (2).