公开(公告)号：DE1489019A1

公开(公告)日：1969-06-19

申请号：DE1489019

申请日：1964-06-27

Applicant: IBM

Inventor： ISRAEL MAISSEL LEON ,  WESLEY SILCOX NORMAN ,  LAMBERT STANDLEY CHARLES

IPC: H01G4/10 ,  H01G4/12 ,  H01G3/075

公开(公告)号：DE1521319A1

公开(公告)日：1969-08-21

申请号：DE1521319

申请日：1965-12-20

Applicant: IBM

Inventor： STANLEY MCGRATH RICHARD ,  WESLEY SILCOX NORMAN

IPC: C23C18/50 ,  H01F41/24

Abstract: 1,054,359. Coating with metals. INTERNATIONAL BUSINESS MACHINES CORPORATION. Nov. 25, 1965 [Dec. 21, 1964], No. 50106/65. Heading C7F. [Also in Division H1] An electroless plating solution to provide a nickel to ferrous ion ratio of 1:1 to 5:1 comprises (g.1.) nickel ions 0À3 to 30, ferrous ions 0À1 to 10, ferric ions 200 to 850 p.p. m., hypophosphite ions 2À0 to 7À0, tartrate ions 5 to 80, ammonium ions 0À6 to 300, pH 8 to 13. The substrate may be Cu, Ni, Co, Fe, steel Al, Zn, Pd, Pt, brass Mn, Cr, Mo, W, Ti, Sn, Ag, carbon or graphite. The nickel and ferrous ions may be chlorides, sulphates, acetates, and sulphanates. The phosphite ion may be Na or K phosphite or hypophosphorus acid. The ferric ion may be chloride, nitrate, sulphate or ammonium sulphate. Preferred sequestering agents are Rochelle salt, Seignette salt, ammonia, ammonium, hydroxide and ammonium chloride. Alkalizing agents, e.g. sodium, potassium or lithium hydroxide, surface active agents, e. g. sodium lauryl sulphate, exaltants, e.g. succinic acid, adipic anions and alkali fluorides, and stabilizers, e.g. thiourea, sodium ethylxanthate and lead sulphate may be added. Other metal ions, e.g. Co, Mo, and Cr may be added. Boric acid and disodium phosphate may be used as buffers.

公开(公告)号：DE1521332A1

公开(公告)日：1969-07-31

申请号：DE1521332

申请日：1966-06-29

Applicant: IBM

Inventor： STANLEY MCGRATH RICHARD ,  WESLEY SILCOX NORMAN

IPC: C03C17/06 ,  C03C17/10 ,  C23C18/16 ,  C23C18/18 ,  H05K1/03 ,  H05K3/18

Abstract: An electroless coating is applied to selected areas of a substrate, by depositing a material, having the stoichiometric properties of silicon monoxide, on the areas, etching the material to make it porous, applying a reducing agent, and so rinsing that the reducing agent remains only on the porous surface. In an example, a glass substrate is coated with chromium and then with silicon monoxide, each by vapour deposition, the monoxide coating is etched with HF, rinsed, immersed in Sn Cl2, rinsed, immersed in Pd Cl2, and then electroless plated with Ni, Cu, or Ni-Fe alloy.

公开(公告)号：DE1521328A1

公开(公告)日：1969-07-24

申请号：DE1521328

申请日：1966-06-22

Applicant: IBM

Inventor： STANLEY MCGRATH RICHARD ,  WESLEY SILCOX NORMAN

IPC: C23C18/50 ,  H01F41/24

Abstract: An electroless plating bath comprises water soluble salts which give a nickelous to ferric ion ratio of 4.5:1 to 31.4:1 and sufficient hydroxyl ions to keep the pH at least 8. Hypophosphite ions are included from 0.29 x 10-3 to 100 x 10-3 mols per litre. The solution may also contain sequestering ions e.g. Rochelle salts, seignette salt, tartaric acid, ammonia, ammonium hydroxide or chloride. The substrate may be Cu, Cu-Be, Ni, Co, Fe, steel, Al, Zn, Pd, Pt, brass, Mn, Cr, Mo, W, Ti, Sn, Ag, carbon or graphite. When the substrate is Cu it may be cleaned with HCl and then immersed in palladium chloride. The deposition may take place in a magnetic field. The substrate may be in the form of a chain made by etching a strip. The water soluble salts may be sulphates, chlorides, acetates, nitrates or sulphonates.