WAFER ORIENTING APPARATUS
    1.
    发明专利

    公开(公告)号:CA1142276A

    公开(公告)日:1983-03-01

    申请号:CA352819

    申请日:1980-05-27

    Applicant: IBM

    Abstract: An apparatus and method for orienting a substantially flat wafer are described. The wafer preferably has two flat registration edges of unequal length. Upon contact of any edge portion of the wafer with a sense means projecting forwardly from one registration surface, air jets are activated to rapidly rotate the wafer one way until the longer of its two registration edges contacts a sense means projecting forwardly from another registration surface. Then air jets are activated to slowly rotate the wafer the opposite way until said longer registration edge contacts another sense means associated with said other registration surface to effect precise registration of the wafer without overshoot as all three sense means are concurrently contacted and activated. Wafer movement by the jets thereupon terminates and vacuum is applied continuously to hold the wafer in place while the work operation is performed thereon. Since the wafer is registered solely by contact with the various sense means (and not by contact with the respective registration surfaces), contamination of the wafer by physical contact is minimized. SA9-78-082

Patent Agency Ranking