1.
    发明专利
    未知

    公开(公告)号:DE69528349T2

    公开(公告)日:2003-05-15

    申请号:DE69528349

    申请日:1995-12-12

    Applicant: IBM

    Abstract: A combined sunken magnetoresistive (MR) read/write head (30B) is provided wherein at least one (S1) of the first and second shield layers (S1,S2) are eliminated or thinned down in an insulation stack region just behind a pole tip region. This provides a depression behind the pole tip region where head components, such as the write coil, insulation stack and pole pieces of a write head, are located. In preferred embodiments, leads for an MR sensor of the head extend parallel to an air bearing surface (ABS) where they connect to first and second conductors beyond the limits of the shield layers. The conductors extend back into the head normal to the air bearing surface without any danger of shorting to the shield layers.

    LOW-PROFILE THIN FILM RECORDING HEAD

    公开(公告)号:PL178620B1

    公开(公告)日:2000-05-31

    申请号:PL31855895

    申请日:1995-08-23

    Applicant: IBM

    Inventor: SANTINI HUGO A E

    Abstract: A thin film low profile write head is provided which has first and second pole pieces which are magnetically connected in a pole tip region and at a back gap. The pole tip region is located between the head surface and a zero throat height and the head has a body region which is located between the zero throat height and the back gap. A plurality of insulation layers are located above the first pole piece in the body region. Each of the insulation layers has an apex where the insulation layer commences and each insulation layer extends from its apex toward the back gap. The plurality of insulation layers typically includes first, second and third insulation layers. In the preferred embodiment the apex of the second insulation layer is located at and defines the zero throat height of the head. This enables a very narrow track width second pole tip to be constructed simultaneously with the second pole piece using ordinary photolithography processes. Further it enables the insulation layers, the coil layer and the second pole piece to be thinner than prior art layers.

    3.
    发明专利
    未知

    公开(公告)号:DE69528349D1

    公开(公告)日:2002-10-31

    申请号:DE69528349

    申请日:1995-12-12

    Applicant: IBM

    Abstract: A combined sunken magnetoresistive (MR) read/write head (30B) is provided wherein at least one (S1) of the first and second shield layers (S1,S2) are eliminated or thinned down in an insulation stack region just behind a pole tip region. This provides a depression behind the pole tip region where head components, such as the write coil, insulation stack and pole pieces of a write head, are located. In preferred embodiments, leads for an MR sensor of the head extend parallel to an air bearing surface (ABS) where they connect to first and second conductors beyond the limits of the shield layers. The conductors extend back into the head normal to the air bearing surface without any danger of shorting to the shield layers.

    WAFER ORIENTING APPARATUS
    4.
    发明专利

    公开(公告)号:CA1142276A

    公开(公告)日:1983-03-01

    申请号:CA352819

    申请日:1980-05-27

    Applicant: IBM

    Abstract: An apparatus and method for orienting a substantially flat wafer are described. The wafer preferably has two flat registration edges of unequal length. Upon contact of any edge portion of the wafer with a sense means projecting forwardly from one registration surface, air jets are activated to rapidly rotate the wafer one way until the longer of its two registration edges contacts a sense means projecting forwardly from another registration surface. Then air jets are activated to slowly rotate the wafer the opposite way until said longer registration edge contacts another sense means associated with said other registration surface to effect precise registration of the wafer without overshoot as all three sense means are concurrently contacted and activated. Wafer movement by the jets thereupon terminates and vacuum is applied continuously to hold the wafer in place while the work operation is performed thereon. Since the wafer is registered solely by contact with the various sense means (and not by contact with the respective registration surfaces), contamination of the wafer by physical contact is minimized. SA9-78-082

    ROTARY ELECTROPLATING CELL WITH CONTROLLED CURRENT DISTRIBUTION

    公开(公告)号:CA1206436A

    公开(公告)日:1986-06-24

    申请号:CA386420

    申请日:1981-09-22

    Applicant: IBM

    Abstract: ROTARY ELECTROPLATING CELL WITH CONTROLLED CURRENT DISTRIBUTION An apparatus and a method for rotary electroplating a thin metallic film having a uniform thickness and composition throughout. The apparatus includes a flow-through jet plate having nozzles of radially increasing size and uniformly spaced radially therethrough, or nozzles of the same size with varying radial spacing therebetween so as to provide a differential flow distribution of the plating solution that impinges on the wafer-cathode where the film is deposited. The spacing and size of the nozzles are critical to obtaining a uniform thickness. The electrical currents to the wafer and to a thieving ring are controlled by variable resistors so as to keep the electrical current to the cathode constant throughout the plating process. In a preferred embodiment the flow-through jet plate has an anode associated therewith in which the exposed area of the anode is maintained at a constant amount during the deposition. This method can simultaneously deposit with a uniform thickness and composition elements having a minimum gap or part size of 1 micrometer or less.

    HOLDER FOR LIQUID PHASE EPITAXIAL GROWTH

    公开(公告)号:CA1163538A

    公开(公告)日:1984-03-13

    申请号:CA356809

    申请日:1980-07-23

    Applicant: IBM

    Abstract: A HOLDER FOR LIQUID PHASE EPITAXIAL GROWTH A holder for liquid phase epitaxial (LPE) growth which eliminates mesas on the surface of the film is described. The holder has two legs to which a ring is connected. The ring has holding means so that it can hold one wafer or two wafers back-to-back. One of the two legs extends vertically below the first ring. In a preferred embodiment a second ring having holding means for a pair of wafers back-to-back is attached to the elongated leg. This holder structure prevents a film from the liquid melt from forming when the holder is withdrawn from the liquid growth solution, thereby eliminating the formation of mesas which occur when the film ruptures. SA979002

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