Patent search ap:("IBM") AND inv:"WILCOX DAVID L" Page 1

1.

发明授权
Flip chip module with non-uniform solder wettable areas on the substrate 失效
Title translation: 具有非均质焊接的片状芯片模块在基板上的湿润区域

公开(公告)号：US3871014A

公开(公告)日：1975-03-11

申请号：US85009369

申请日：1969-08-14

Applicant: IBM

Inventor： KING WILLIAM J , WILCOX DAVID L

IPC: H01L21/60 , H01L3/00 , H01L5/00

CPC classification number: H01L24/16 , H01L24/12 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/10175 , H01L2224/13099 , H01L2224/1403 , H01L2224/1701 , H01L2224/81801 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/19041 , H01L2924/19043 , Y10T29/49144 , H01L2924/00012

Abstract: The interconnecting joints between a semiconductor chip and a substrate are non-uniform in shape. The joints are solder and have varying shapes due to varying sizes of the solder wettable regions on the substrate. Smaller solder wettable regions cause the solder connectors to increase chip substrate standoff thereby relieving the stress on the remaining joints.

Abstract translation: 半导体芯片和基板之间的互连接头的形状不均匀。接头是焊料并且由于衬底上的焊料可润湿区域的尺寸变化而具有变化的形状。较小的焊料可润湿区域导致焊料连接器增加芯片基板间隙，从而缓解其余接头处的应力。

2.

发明授权
Method of forming a glass filled gap 失效
Title translation: 形成玻璃填充气隙的方法

公开(公告)号：US3458926A

公开(公告)日：1969-08-05

申请号：US3458926D

申请日：1965-10-08

Applicant: IBM

Inventor： MAISSEL LEON I , WILCOX DAVID L

IPC: G11B5/23 , G11B5/235 , G11B5/42

CPC classification number: G11B5/235 , G11B5/232 , Y10T29/49057

3.

发明专利
MULTILAYER CIRCUITS 未知

公开(公告)号：CA847547A

公开(公告)日：1970-07-21

申请号：CA847547D

Applicant: IBM

Inventor： WILCOX DAVID L , AHN JUNGHI , SCHWARTZ BERNARD

4.

发明专利
PROCESS FOR THE PREPARATION OF MULLITE BY A SOLID STATE REACTION 未知

公开(公告)号：CA990049A

公开(公告)日：1976-06-01

申请号：CA171586

申请日：1973-05-15

Applicant: IBM

Inventor： GARDNER RICHARD A , WILCOX DAVID L

IPC: C04B35/18 , H01B3/12 , H01L21/48 , H01L23/15

5.

发明专利
MULLITE PACKAGE FOR INTEGRATED CIRCUIT DEVICES 未知

公开(公告)号：CA994818A

公开(公告)日：1976-08-10

申请号：CA171592

申请日：1973-05-15

Applicant: IBM

Inventor： GARDNER RICHARD A , WILCOX DAVID L

IPC: C01B33/26 , C04B35/18 , H01L21/48

6.

发明专利
FLIP CHIP MODULE WITH NON-UNIFORM SOLDER WETTABLE AREAS ON THE SUBSTRATE 未知

公开(公告)号：CA941980A

公开(公告)日：1974-02-12

申请号：CA89056

申请日：1970-07-24

Applicant: IBM

Inventor： KING WILLIAM J , WILCOX DAVID L

IPC: H01L21/60 , H01L1/14

Abstract: The interconnecting joints between a semiconductor chip and a substrate are non-uniform in shape. The joints are solder and have varying shapes due to varying sizes of the solder wettable regions on the substrate. Smaller solder wettable regions cause the solder connectors to increase chip substrate standoff thereby relieving the stress on the remaining joints.

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