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    3.
    发明专利
    未知

    公开(公告)号：DE3787399D1

    公开(公告)日：1993-10-21

    申请号：DE3787399

    申请日：1987-04-22

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  LUSSOW ROBERT OTIS ,  NUFER ROBERT WOLFF ,  SCHWARTZ BERNARD ,  ACOCELLA JOHN ,  REDDY SRINIVASA N

    IPC: H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H01L23/52

    Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non porous, homogeneous metal patterns (26), whereas the vertical interplanar connection conductors (26A) are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet (24) having a release layer, then transferring the pattern to a ceramic green sheet (22). Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.

    5.
    发明专利
    未知

    公开(公告)号：DE1524777A1

    公开(公告)日：1970-10-08

    申请号：DEJ0033173

    申请日：1967-03-09

    Applicant: IBM

    Inventor： SCHWARTZ BERNARD ,  LEON TURK HAROLD

    IPC: G11B5/127 ,  G11B5/133 ,  G11B5/265 ,  G11B5/29 ,  G11B5/42

    Abstract: 1,144,288. Laminates. INTERNATIONAL BUSINESS MACHINES CORP. 9 March, 1967 [11 March, 1966], No. 11045/67. Heading B5N. [Also in Divisions G 5 and H1] A laminated structure comprises a plurality of layers of particulate magnetic material with a binder, separated by layers of particulate non- magnetic material with a binder, and sintered to form a unitary structure. Each layer may be formed separately by mixing the particulate material with the binder and a solvent, spreading it on a base, and peeling it off after evaporation of the solvent. The layers are then stacked and sintered at 1000-1500‹ C. The materials used may be a magnetic ferrite, and Pd or a non-magnetic ferrite, in a polyvinyl butyral resin binder. The structure may be cut prior to sintering to form toroids, or shapes used in making recording heads.

    7.
    发明专利
    未知

    公开(公告)号：DE3787399T2

    公开(公告)日：1994-04-21

    申请号：DE3787399

    申请日：1987-04-22

    Applicant: IBM

    Inventor： HERRON LESTER WYNN ,  LUSSOW ROBERT OTIS ,  NUFER ROBERT WOLFF ,  SCHWARTZ BERNARD ,  ACOCELLA JOHN ,  REDDY SRINIVASA N

    IPC: H05K3/46 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/20 ,  H01L23/52

    Abstract: A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non porous, homogeneous metal patterns (26), whereas the vertical interplanar connection conductors (26A) are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet (24) having a release layer, then transferring the pattern to a ceramic green sheet (22). Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.

    9.
    发明专利
    未知

    公开(公告)号：DE3481606D1

    公开(公告)日：1990-04-19

    申请号：DE3481606

    申请日：1984-11-23

    Applicant: IBM

    Inventor： KUMAR ANANDA H ,  SCHWARTZ BERNARD

    IPC: H05K3/46 ,  C04B41/45 ,  C04B41/52 ,  C04B41/81 ,  C04B41/89 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K3/24 ,  C04B41/88

    Abstract: A blanket layer (81) of a sintering agent, like palladium, is coated on a polyvinyl butyral resin layer (82) on a polyester film (83). Said coated polyester film is superimposed on a unsintered dielectric substrate provided with a metallurgical pattern of a refractory metal, like molybdenum, in such a way, that the sintering agent layer (81) is adjacent the metallurigcal pattern (55) and the unsintered dielectric substrate (50). The polyester film (83) is stripped, while said polyvinyl butyral layer (82) and said sintering agent layer (81) remain on the surface of the metallurgical pattern (55) and said unsintered dielectric substrate. The resulting composite is sintered to a fired structure, whereby said sintering agent is alloyed with the metallurgical pattern whereas said polyvinyl butyral and said sintering agent not in contact with the metallurigcal pattern (55) are volatilized off. The finished structure has a metallurgical pattern with a densified surface. … If the substrate consists of a ceramic containing a certain amount of a glass frit the metallurgical pattern having undergone the inventive process is substantially glass-free.

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