ELECTRONIC ASSEMBLY WITH FORCED CONVECTION COOLING

    公开(公告)号:DE3278616D1

    公开(公告)日:1988-07-07

    申请号:DE3278616

    申请日:1982-09-29

    Applicant: IBM

    Abstract: The electronic assembly has a support plate (10), on one surface of which are mounted side by side in the longitudinal direction several electronic equipment cabinets (11,12). Also on this surface there is at least one air distribution channel (21) extending longitudinally along the plate and a cooling fan (20). The latter (20) forces air along the air distribution channel (21) into the cabinets (11,12) to cool electrical components in them. The cross-section of each air distribution channel (21) may vary along its length so that different amounts of air are directed to the various components according to their cooling requirements. There may also be several secondary air distribution channels branching laterally from the main channel (21) and an arrangement for confining the air to flow into the secondary channels.

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