公开(公告)号：CA1115822A

公开(公告)日：1982-01-05

申请号：CA329381

申请日：1979-06-08

Applicant: IBM

Inventor： OKTAY SEVGIN ,  TORGERSEN GERARD J ,  WONG ALEXANDER C

IPC: H05K7/20 ,  H01L23/42 ,  H01L23/427 ,  H01L23/44 ,  H01L23/473 ,  H01L23/34

Abstract: COOLING TUNNELS FOR SEMICONDUCTOR DEVICES A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned 80 that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels. FI9-77-066