公开(公告)号：AU6333096A

公开(公告)日：1998-01-07

申请号：AU6333096

申请日：1996-06-13

Applicant: IBM

Inventor： WOYCHIK CHARLES G ,  SARKHEL AMIT K

IPC: B23K35/02 ,  B23K35/26 ,  C22C13/02 ,  H05K3/34

公开(公告)号：AU6279296A

公开(公告)日：1998-01-07

申请号：AU6279296

申请日：1996-06-13

Applicant: IBM ,  WOIYCHIK CHARLES G K ,  SARKHEL AMIT K

Inventor： WOYCHIK CHARLES G ,  SARKHEL AMIT K

IPC: B23K35/02 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34

Abstract: A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.