公开(公告)号：AU6333096A

公开(公告)日：1998-01-07

申请号：AU6333096

申请日：1996-06-13

Applicant: IBM

Inventor： WOYCHIK CHARLES G ,  SARKHEL AMIT K

IPC: B23K35/02 ,  B23K35/26 ,  C22C13/02 ,  H05K3/34

公开(公告)号：AU6279296A

公开(公告)日：1998-01-07

申请号：AU6279296

申请日：1996-06-13

Applicant: IBM ,  WOIYCHIK CHARLES G K ,  SARKHEL AMIT K

Inventor： WOYCHIK CHARLES G ,  SARKHEL AMIT K

IPC: B23K35/02 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34

Abstract: A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.

公开(公告)号：MY127824A

公开(公告)日：2006-12-29

申请号：MYPI20020370

申请日：2002-02-04

Applicant: IBM

Inventor： RAY SUDIPTA KUMAR ,  SARKHEL AMIT K

IPC: B23K1/00 ,  H01L21/44 ,  B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H01L21/60 ,  H01L23/485 ,  H01L23/488 ,  H01L23/498 ,  H05K3/34

Abstract: A METHOD AND STRUCTURE FOR SOLDERABLY COUPLING AN ELECTRONIC MODULE (E.G.A CERAMIC OR PLASTIC BALL GRID ARRAY MODULE) TO A CIRCUIT BOARD.A LEAD-FREE SOLDER BALL IS SOLDERED TO THE MODULE WITHOUT USING A JOINING SOLDER TO EFFECTUATE THE SOLDERING.THE SOLDER BALL COMPRISES A TIN-ANTIMONY ALLOY THAT INCLUDES ABOUT 3TO ABOUT 15% ANTIMONY BY WEIGHT. THE SOLDER BALL IS SOLDERED TO THE CIRCUIT BOARD WITH A LEAD-FREE JOINER SOLDER. THE JOINER SOLDER COMPRISES A TIN-SILVER-COPPER ALLOY THAT INCLUDES BY WEIGHT ABOUT 95.5-96.0% TIN, ABOUT 3.5-4.0% SILVER, AND ABOUT 0.5-1.0% COPPER.THE RESULTANT SOLDER CONNECTION BETWEEN THE MODULE AND THE CIRCUIT BOARD HAS A FATIGUE LIFE OF AT LEAST ABOUT 90% OF A FATIGUE LIFE OF A REFERENCE STRUCTURE. THE REFERENCE STRUCTURE HAS A 90Pb/10Sn SOLDER BALL JOINED TO BOTH THE MODULE AND THE CIRCUIT CARD BY A 63Sn/37Pb JOINER SOLDER.(FIGURE 2)