Precision tool and workpiece positioning apparatus with ringout detection
    1.
    发明授权
    Precision tool and workpiece positioning apparatus with ringout detection 失效
    精密刀具和工件定位装置,具有振铃检测功能

    公开(公告)号:US3886421A

    公开(公告)日:1975-05-27

    申请号:US39550273

    申请日:1973-09-10

    Applicant: IBM

    Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined position relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position of the workpiece relative to a fixed reference and emits a signal output which is compared, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site. Thereafter the error between the actual position address and the desired position address, although very small, is fed to second apparatus for positioning the tool a very small amount to precisely position the tool relative to the workpiece. The purpose of this abstract is to enable the public and the Patent Office to determine rapidly the subject matter of the technical disclosure of the application. This abstract is neither intended to define the invention of the application nor is it intended to be limiting as to the scope thereof.

    Abstract translation: 用于通过将工件定位在预定位置,然后将工具相对于现场以最小总时间定位在精确的预定位置,将工件和工具相对于彼此定位的精确位置的装置。 该装置包括连接到工件的闭环位置和速度敏感伺服系统,伺服系统包括用于将工件定位在预定位置的定位装置。 位置指示器确定工件相对于固定基准的实际位置,并发出在误差发生器中与工件相对于基准的期望位置进行比较的信号输出。 来自误差发生器的差分信号被施加到定位器,并用于将工件带到现场。 定位器具有与来自误差发生器的定位信号配合的速度反馈,以将工件驱动到预定位置。 此后,尽管非常小的实际位置地址和期望的位置地址之间的误差被馈送到第二装置,用于将工具定位非常小以精确地定位工具相对于工件。

    PRECISION TOOL AND WORKPIECE POSITIONING APPARATUS WITH RINGOUT DETECTION

    公开(公告)号:CA1032635A

    公开(公告)日:1978-06-06

    申请号:CA206917

    申请日:1974-08-13

    Applicant: IBM

    Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined position relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position of the workpiece relative to a fixed reference and emits a signal output which is compared, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site. Thereafter the error between the actual position address and the desired position address, although very small, is fed to second apparatus for positioning the tool a very small amount to precisely position the tool relative to the workpiece.

    CONTROLS FOR SEMICONDUCTOR WAFER ORIENTOR

    公开(公告)号:CA1097770A

    公开(公告)日:1981-03-17

    申请号:CA291007

    申请日:1977-11-16

    Applicant: IBM

    Abstract: CONTROLS FOR SEMICONDUCTOR WAFER ORIENTOR This specification deals with electro-optic controls for stopping and orienting of a semiconductor wafer being transported along a track on an air film. At one or more locations along the track the characteristics of the air film are changed by electronic controls responding to optical pickups sensing the position and orientation of a semiconductor wafer entering the particular location on the air film to first stop the wafer in the general proximity of the location, then center the wafer in the location and after the wafer is centered, quickly rotate the wafer until it assumes the desired orientation. All this is done without edge contact of the wafer by any solid objects.

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