Precision tool and workpiece positioning apparatus with ringout detection
    1.
    发明授权
    Precision tool and workpiece positioning apparatus with ringout detection 失效
    精密刀具和工件定位装置,具有振铃检测功能

    公开(公告)号:US3886421A

    公开(公告)日:1975-05-27

    申请号:US39550273

    申请日:1973-09-10

    Applicant: IBM

    Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined position relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position of the workpiece relative to a fixed reference and emits a signal output which is compared, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site. Thereafter the error between the actual position address and the desired position address, although very small, is fed to second apparatus for positioning the tool a very small amount to precisely position the tool relative to the workpiece. The purpose of this abstract is to enable the public and the Patent Office to determine rapidly the subject matter of the technical disclosure of the application. This abstract is neither intended to define the invention of the application nor is it intended to be limiting as to the scope thereof.

    Abstract translation: 用于通过将工件定位在预定位置,然后将工具相对于现场以最小总时间定位在精确的预定位置,将工件和工具相对于彼此定位的精确位置的装置。 该装置包括连接到工件的闭环位置和速度敏感伺服系统,伺服系统包括用于将工件定位在预定位置的定位装置。 位置指示器确定工件相对于固定基准的实际位置,并发出在误差发生器中与工件相对于基准的期望位置进行比较的信号输出。 来自误差发生器的差分信号被施加到定位器,并用于将工件带到现场。 定位器具有与来自误差发生器的定位信号配合的速度反馈,以将工件驱动到预定位置。 此后,尽管非常小的实际位置地址和期望的位置地址之间的误差被馈送到第二装置,用于将工具定位非常小以精确地定位工具相对于工件。

    Method and apparatus for handling workpieces
    2.
    发明授权
    Method and apparatus for handling workpieces 失效
    处理工作的方法和装置

    公开(公告)号:US3874525A

    公开(公告)日:1975-04-01

    申请号:US37527973

    申请日:1973-06-29

    Applicant: IBM

    Abstract: A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elevator, which is within the vacuum chamber, through an opening, which is vacuum sealed by the elevator at this time, in the top wall of the vacuum chamber. A lid is then placed over the opening from the exterior to cooperate with the elevator to form an ante chamber with the wafer disposed therein. The ante chamber, which is purged prior to the lid being placed over the opening, is then reduced to a vacuum of 5 X 10 2 torr. The elevator then lowers the wafer into a horizontal plane in which a transfer mechanism is located to transfer the wafer from the elevator to an X-Y table on which the wafer is mounted for pattern writing of the chips. The transfer mechanism includes an arm, which is indexed 180* during each activation of an indexing means connected thereto, and gripping means at each end of the arm to simultaneously grasp and release wafers on the elevator and the X-Y table to interchange the wafers between the elevator and the table.

    Abstract translation: 其上形成有芯片的半导体晶片从100级环境移动到真空室中,其中通过电子束对芯片进行图案写入,而不会显着影响真空室中的真空水平。 最初将晶片设置在真空室内的电梯上,该电梯此时由电梯真空密封在真空室的顶壁中。 然后将盖子从外部放置在开口上方以与电梯配合以形成设置在其中的晶片的前室。 然后在盖子被放置在开口之前被清除的前室被减小到5×10 -2托的真空。 然后,电梯将晶片降低到水平平面中,在该水平平面中传送机构位于其中,以将晶片从电梯传送到安装有晶片的X-Y工作台,用于芯片的图案写入。 传送机构包括臂,在连接到其上的分度装置的每个激活期间被分度180度,并且在臂的每个端部处抓握装置,以同时在电梯和XY工作台上抓住并释放晶片,以将晶片在 电梯和桌子。

    Precision tool and workpiece positioning apparatus
    3.
    发明授权
    Precision tool and workpiece positioning apparatus 失效
    精密工具和工件定位装置

    公开(公告)号:US3904945A

    公开(公告)日:1975-09-09

    申请号:US39589073

    申请日:1973-09-10

    Applicant: IBM

    Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined position relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position of the workpiece relative to compared, fixed reference and emits a signal output which is compsred, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site. Thereafter the error between the actual position address and the desired position address, although very small, is fed to second apparatus for positioning the tool a very small amount to precisely position the tool relative to the workpiece. The purpose of this abstract is to enable the public and the Patent Office to determine rapidly the subject matter of the technical disclosure of the application. This abstract is neither intended to define the invention of the application nor is it intended to be limiting as to the scope thereof.

    Abstract translation: 用于通过将工件定位在预定位置,然后将工具相对于现场以最小总时间定位在精确的预定位置,将工件和工具相对于彼此定位的精确位置的装置。 该装置包括连接到工件的闭环位置和速度敏感伺服系统,伺服系统包括用于将工件定位在预定位置的定位装置。 位置指示器确定工件相对于比较固定参考的实际位置,并将误差发生器中产生的信号输出与工件相对于参考的所需位置发射。 来自误差发生器的差分信号被施加到定位器,并用于将工件带到现场。 定位器具有与来自误差发生器的定位信号配合的速度反馈,以将工件驱动到预定位置。 此后,尽管非常小的实际位置地址和期望的位置地址之间的误差被馈送到第二装置,用于将工具定位非常小以精确地定位工具相对于工件。

    COOLING MEANS FOR INTEGRATED CIRCUIT CHIP DEVICE.
    4.
    发明公开
    COOLING MEANS FOR INTEGRATED CIRCUIT CHIP DEVICE. 失效
    冷却器的高集成电路。

    公开(公告)号:EP0097157A4

    公开(公告)日:1985-03-08

    申请号:EP82900586

    申请日:1981-12-29

    Applicant: IBM

    Abstract: A cooling means (18) for a circuit chip device (10) employs a noneutectic metal alloy (22) to form a low thermal resistance bridging interface between the surface of the chip device and a heat sink (18). The alloy has a solidus-liquidus temperature range such that the solidus is slightly below the maximum operating temperature of the chip, and thus has the capability to reestablish and maintain the interface at a low thermal resistance if stressed during circuit operation, even with a low contact load at the interface of the chip device and the heat sink. In addition to the chip interface, the above cooling means is also used at other interfacial regions of the heat sink, dependent on design, to achieve very low thermal resistance.

    5.
    发明专利
    未知

    公开(公告)号:FR2316042A1

    公开(公告)日:1977-01-28

    申请号:FR7615566

    申请日:1976-05-17

    Applicant: IBM

    Abstract: Disclosed is an X-Y table for positioning semiconductor workpieces in a vacuum environment with a high degree of speed and accuracy. The X and Y prime movers are mounted on adjacent external surfaces of the vacuum chamber. The first motor associated with the drive in the Y direction seals with an O-ring onto the front surface of the chamber. A second motor associated with the X drive is fixedly mounted to one of the sides of the chamber. The lower stage providing motion in the Y direction has a single degree of freedom relative to the vacuum chamber. The upper stage providing motion in the X direction is connected to the lower Y stage and has two degrees of freedom relative to the vacuum chamber. The entire X-Y table assembly is mounted on rails in parallel with the Y direction of motion such that by removing the front wall of the vacuum chamber, the entire assembly may be removed for repair and/or maintenance. By such modular replacement, the entire E-beam tool can resume operation.

    PRECISION TOOL AND WORKPIECE POSITIONING APPARATUS WITH RINGOUT DETECTION

    公开(公告)号:CA1032635A

    公开(公告)日:1978-06-06

    申请号:CA206917

    申请日:1974-08-13

    Applicant: IBM

    Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined position relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position of the workpiece relative to a fixed reference and emits a signal output which is compared, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site. Thereafter the error between the actual position address and the desired position address, although very small, is fed to second apparatus for positioning the tool a very small amount to precisely position the tool relative to the workpiece.

    COOLING MEANS FOR INTEGRATED CIRCUIT CHIP DEVICE

    公开(公告)号:DE3176475D1

    公开(公告)日:1987-11-05

    申请号:DE3176475

    申请日:1981-12-29

    Applicant: IBM

    Abstract: Semiconductor assembly comprises (a) a substrate(12); (b) a semiconductor chip(10) having one surface bonded to the substrate, (c) a heat transfer element closely adjacent the second surface of the chip; (d) a thin layer(22) of heat conductive noneutectic alloy at the interface between heat transfer element and chip, pref. an alloy contg. Bi; and pref. (e) a spring type piston providing a load force to the heat transfer element, increasing contact between element and chip. The assembly pref. also includes a hat(20) providing a cover for the assembly and diffusing heat. A thin layer(22) of conductive noneutectic alloy is pref. provided at the interface between heat transfer element and hat surface. A diagonal spring type piston(16) pref. provides a load force increasing contact between heat transfer element and hat and chip surfaces. The thermal resistance of the chip interface is pref. 0.1-0.2 deg.C./W and of the heat interface is pref. 0.01-0.02 deg.C./W, both for contact load of 100g. The alloy allows resistance loads 5-7 times less than those obtd. using thermal grease.

    WORKPIECE POSITIONING APPARATUS
    8.
    发明专利

    公开(公告)号:CA1037506A

    公开(公告)日:1978-08-29

    申请号:CA255238

    申请日:1976-06-18

    Applicant: IBM

    Abstract: Disclosed is an X-Y table for positioning semiconductor workpieces in a vacuum environment with a high degree of speed and accuracy. The X and Y prime movers are mounted on adjacent external surfaces of the vacuum chamber. The first motor associated with the drive in the Y direction seals with an "O" ring onto the front surface of the chamber. A second motor associated with the X drive is fixably mounted to one of the sides of the chamber. The lower stage providing motion in the Y direction has a single degree of freedom relative to the vacuum chamber. The upper stage providing motion in the X direction is connected to the lower Y stage and has two degrees of freedom relative to the vacuum chamber. The entire X-Y table assembly is mounted on rails in parallel with the Y direction of motion such that by removing the front wall of the vacuum chamber, the entire assembly may be removed for repair and/or maintenance. By such modular replacement, the entire E-beam tool can resume operation.

    9.
    发明专利
    未知

    公开(公告)号:FR2381700A1

    公开(公告)日:1978-09-22

    申请号:FR7802109

    申请日:1978-01-20

    Applicant: IBM

    Abstract: This specification deals with the stopping, positioning, orienting and redirecting a semiconductor wafer being transported along a track on an air film or bed of air. The stopping mechanism is an air jet located in a groove in the track, wafers passing over this air jet on an air film are sensed by a pneumatic sensor that turns on the air jet to set up an air stream under the transporting surface of the air film. This air stream sucks the fluid in the air film along with it in the groove causing a vacuum in the bed in the area of the nozzle of the air jet. The wafers are then stopped by the suction of the vacuum. Positioning, orienting and redirecting is done using the air jet and pneumatic sensor in combination with special air jet arrangements and operations.

    PRECISION TOOL AND WORKPIECE POSITIONING APPARATUS

    公开(公告)号:CA1033439A

    公开(公告)日:1978-06-20

    申请号:CA206940

    申请日:1974-08-13

    Applicant: IBM

    Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined position relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position of the workpiece relative to compared, fixed reference and emits a signal output which is compsred, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site. Thereafter the error between the actual position address and the desired position address, although very small, is fed to second apparatus for positioning the tool a very small amount to precisely position the tool relative to the workpiece.

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