公开(公告)号：JPH06236871A

公开(公告)日：1994-08-23

申请号：JP571393

申请日：1993-01-18

Applicant: IBM

Inventor： YAMADA SHINJI ,  SHIRAI MASAHARU

IPC: H01L21/312 ,  G03F7/16 ,  H05K3/28

Abstract: PURPOSE: To provide a method for forming an insulating layer, without rumples from resin which has a photosetting property and a thermosetting property. CONSTITUTION: Liquid photosensitive epoxy resin solution is applied as an insulating layer on a board and is dried. The resin layer is made to absorb a solvent by passing through a roll coater, filled with the solvent for resin, and a density gradient of remaining solvent in the resin layer is reduced. In this case, a space is so made as the resin layer surface and the solvent applying roll not to contact. After a pattern exposure a development is made, and thermosetting is performed. Instead of the resin layer, absorbing a solvent a Mylar (registered trademark) film is pasted on the resin layers, is heated, and the density gradient of the remaining solvent in the resin layer can be reduced.

公开(公告)号：JP2000183496A

公开(公告)日：2000-06-30

申请号：JP35091698

申请日：1998-12-10

Applicant: IBM

Inventor： SHIRAI MASAHARU ,  YAMADA SHINJI

IPC: H05K3/06 ,  G03F7/16 ,  G03F7/26 ,  G03F7/38 ,  H05K3/00 ,  H05K3/26 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring board, which prevents void bubbles generated in a photosensitive resin layer due to a stuck substance, such as a contamination or the like applied to the photosensitive resin layer and which can reduce short circuits between interconnections or a drop in the breakdown voltage. SOLUTION: This manufacturing method for a wiring board includes a the steps in which a photosensitive resin layer 14 is prepared, additionally, step in which the photosensitive resin layer 14 is press-treated, a step in which the press-treated photosensitive resin layer 14 is exposed by using an exposure mask on which a prescribed wiring pattern is formed a step in which the exposed photosensitive resin layer 14 is developed, and a stuck substance 16 stuck to the surface of the photosensitive resin layer 14 is pushed into the layer 14.

公开(公告)号：JP2002111225A

公开(公告)日：2002-04-12

申请号：JP2000282149

申请日：2000-09-18

Applicant: IBM

Inventor： YAMADA SHINJI ,  TSUKADA YUTAKA

IPC: H05K3/46 ,  B32B3/02 ,  B32B27/34 ,  B32B27/38 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide a printed-wiring board for improving the yield of a printed- wiring board, especially a build-up multilayer printed-wiring board, the manufacturing method of the printed-wiring board, and a photomask used for the method. SOLUTION: The printed-wiring board includes a base substrate 2 containing conductor circuit patterns 6a and 6b on the surface and at least a layer of resin layer 3 provided on the base layer. In the printed-wiring board, the resin layer is formed by a photosensitive resin, and a photosensitive resin layer on the conductive circuit pattern is exposed by the amount of exposure according to the area of the conductive circuit patterns for formation.