公开(公告)号：SG93894A1

公开(公告)日：2003-01-21

申请号：SG200005366

申请日：2000-09-20

Applicant: IBM

Inventor： KENJI ITOH ,  NAOKI KUROSU ,  YOHTAROH ICHIMURA ,  TATSUSHI YOSHIDA

IPC: G11B5/60 ,  B23K20/00 ,  B23K20/10 ,  B23K101/38 ,  G11B21/21 ,  H01L21/60 ,  H01L21/607

Abstract: The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P1, a bonding wedge 21 abuts the wire 71, whereby a load is exerted on the wire 71. The wire 71 transforms by an amount of transformation A, and the transformation stops at point P2. The transformation amount A varies greatly. At point P3 (T1), ultrasonic wave vibration is exerted and the transformation of the wire 71 is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A+B becomes small. At point P4 (T1+T2), the transformation amount A+B is maintained substantially constant. At this point P4, the transformation amount of the wire 71 is set to 0 and the measurement of the transformation amount of the wire 71 is started. And until the transformation amount of the wire 71 reaches an amount of transformation C (point P5), a load and ultrasonic wave vibration are given.