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公开(公告)号：SG91364A1
公开(公告)日：2002-09-17
申请号：SG200103175
申请日：2001-05-25
Applicant: IBM
Inventor： TATSUMI TUCHIYA , TATSUSHI YOSHIDA , YASUHIRO MITA , TADAAKI TOMIYAMA , TAKAO KIDACHI , SURYA PATTANAIK
Abstract: A capillary tube for a solder ball connection device connects a first connection surface of a pad to a second connection surface of a pad with a solder ball. The first connection surface is formed at a slider held by a slider holder in a disk unit. The second connection surface is formed at an end of a lead wired to the slider holder. The capillary tube has a ball regulator with a substantially conic, hollow portion. The solder ball regulator has an opening at its top that opens to the tip of the hollow portion. The center axes of the hollow portion and the opening are common. The solder ball regulator also has a pair of projections along the center axis around the opening, where the projections face each other with the center axis therebetween. The projections regulate the movement of the solder ball. The tip of the hollow portion is tapered when viewed from a line connecting the pair of projections and the extreme tips of the tapered tip portions.
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Patent Agency Ranking
公开(公告)号：SG102642A1
公开(公告)日：2004-03-26
申请号：SG200106752
申请日：2001-11-05
Applicant: IBM
Inventor： TAKAO KIDACHI , TADAAKI TOMIYAMA , YOSHIO UEMATSU , HIROMI ISHIKAWA , TATSUSHI YOSHIDA , HIROYOSHI YOKOME , YUKIHIRO NAKAMURA , HISASHI OHYAMA , TATSUMI TSUCHIYA
Abstract: A method of assembling a head gimbal assembly. The method comprises a series of steps which include: stacking a base plate, a load beam, and a flexure to form a three-layered stacked series with at least a bottom layer being a base plate series; joining portions of the load beam to the base plate, and the flexure to the load beam in the three-layered stacked series to make a suspension section; attaching a slider to the flexure in the suspension section to make a head gimbal assembly; load-bending a hinge portion formed in the head gimbal assembly; and heating the hinge portion in order to adjust a bending load on the hinge portion at a predetermined bending angle to a predetermined value.
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公开(公告)号：SG99312A1
公开(公告)日：2003-10-27
申请号：SG200003686
申请日：2000-07-03
Applicant: IBM
Inventor： TATSUMI TSUCHIYA , TATSUSHI YOSHIDA , HIROYASU TSUCHIDA , HIROO INOUE , SURYA PATTANAIK , HIROMI ISHIKAWA , MASAAKI NANBA
Abstract: Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.
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公开(公告)号：SG93894A1
公开(公告)日：2003-01-21
申请号：SG200005366
申请日：2000-09-20
Applicant: IBM
Inventor： KENJI ITOH , NAOKI KUROSU , YOHTAROH ICHIMURA , TATSUSHI YOSHIDA
IPC: G11B5/60 , B23K20/00 , B23K20/10 , B23K101/38 , G11B21/21 , H01L21/60 , H01L21/607
Abstract: The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P1, a bonding wedge 21 abuts the wire 71, whereby a load is exerted on the wire 71. The wire 71 transforms by an amount of transformation A, and the transformation stops at point P2. The transformation amount A varies greatly. At point P3 (T1), ultrasonic wave vibration is exerted and the transformation of the wire 71 is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A+B becomes small. At point P4 (T1+T2), the transformation amount A+B is maintained substantially constant. At this point P4, the transformation amount of the wire 71 is set to 0 and the measurement of the transformation amount of the wire 71 is started. And until the transformation amount of the wire 71 reaches an amount of transformation C (point P5), a load and ultrasonic wave vibration are given.
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公开(公告)号：SG93867A1
公开(公告)日：2003-01-21
申请号：SG200002912
申请日：2000-05-29
Applicant: IBM
Inventor： HIROO INOUE , TATSUSHI YOSHIDA , TATSUMI TSUCHIYA , YURIKA SHIMOZAWA
Abstract: The present invention provides a head supporting arm that allows for laser tacking while having a merging lip and limiters for loading/unloading respectively. A head supporting arm according to the present invention includes a load beam, and a flexure connecting the load beam to a slider. The load beam having a dimple for generating a gimbal motion between the flexure and the slider. The slider having a head connected to its one end. The head supporting arm of the present invention further including an exposure opening formed in the load beam. The exposure opening allowing for the exposing of the bonding portion of the flexure that is bonded to the other end of the slider. The exposure opening further providing an opening to extend the limiters formed unitarily with the flexure 36 onto a surface of the load beam that is opposite to the surface on which the flexure 36 is provided. The extended limiters are hooked to the load beam at the opposite surface.
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公开(公告)号：SG85599A1
公开(公告)日：2002-01-15
申请号：SG1998001812
申请日：1998-07-16
Applicant: IBM
Inventor： YASUHIRO MITA , TATSUSHI YOSHIDA , HIROMI ISHIKAWA , TATSUYA TANAKA , HIROYASU TSU CHIDA , TAKUYA SATOH
Abstract: A head support arm of a disk drive device comprises; a front portion supporting a head/slider assembly, a rear portion pivotally mounted on a frame of the disk drive device, a bending portion between the front portion and the rear portion, a plurality of electrically conductive wires covered by a tube, and a first fixing position and a second fixing position symmetrically located on both sides of a center line of the head support arm at positions between the bending portion and the front portion, characterized in that the tube is attached to the head support arm between the bending portion and the rear portion, the plurality of electrically conductive wires extending from a front end of the tube on the side of the front portion of the head support arm extend over the bending portion and are divided into a first group and a second group, the first group of wires is fixed to the second fixing position.
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