公开(公告)号：CA2180807A1

公开(公告)日：1998-01-10

申请号：CA2180807

申请日：1996-07-09

Applicant: IBM CANADA

Inventor： BOUTIN LYNDA ,  LETOURNEAU MARTIAL A ,  TETREAULT REAL

IPC: B29C45/26 ,  B29C45/02 ,  B29C70/70 ,  B29L31/34 ,  H01L21/56 ,  H01L23/02 ,  H01L23/12 ,  H01L23/24 ,  H01L23/29 ,  H01L23/50

Abstract: A method and resulting integrated circuit package is disclosed for encapsula tingintegrated circuit chips using transfer molding tech niques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit card and the contact s are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carr ier.Liquid plastic is forced into the cavity via a runne r in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components .