公开(公告)号：DE2207546A1

公开(公告)日：1973-08-23

申请号：DE2207546

申请日：1972-02-18

Applicant: IBM DEUTSCHLAND

Inventor： ENGELKE HELMUT DIPL PHYS DR

IPC: G01R31/26 ,  G01R31/02 ,  G01R31/302 ,  G01R31/305 ,  H01L21/66

Abstract: A non-contact method of testing for the electrical continuity of a conductor line. The line is embedded in a medium with its ends exposed. A target mask having holes aligned with the conductor line ends is proximately positioned with respect to the medium. Primary electrons having a high acceleration are directed at the mask and are converted into low energy secondary electron emission for striking the conductor line ends emitting additional secondary electrons which are monitored at collectors forming a part of the mask to obtain an indication of the continuity state of the conductor line.

公开(公告)号：DE2922416A1

公开(公告)日：1980-12-11

申请号：DE2922416

申请日：1979-06-01

Applicant: IBM DEUTSCHLAND

Inventor： BOHLEN HARALD DIPL PHYS ,  ENGELKE HELMUT DIPL PHYS DR ,  GRESCHNER JOHANN DIPL PHYS DR ,  NEHMIZ PETER DIPL PHYS DR

IPC: H01L21/027 ,  G03F1/00 ,  G03F1/20 ,  H01L21/31 ,  H01L21/308

Abstract: A mask for structuring surface areas and a method for manufacture thereof. The mask includes at least one metal layer with throughgoing apertures which define the mask pattern and a semiconductor substrate for carrying the metal layer. The semiconductor substrate has throughholes that correspond to the mask pattern. The throughholes in the semiconductor substrate extend from the metal layer-covered surface on the front to at least one tubshaped recess which extends from the other back surface into the semiconductor substrate. Holes are provided in a surface layer in the semiconductor substrate. The surface layer differs in its doping from the rest of the substrate and the holes which are provided in the surface layer have lateral dimensions larger than the apertures in the metal layer so that the metal layer protrudes over the surface layer.

公开(公告)号：DE2837590A1

公开(公告)日：1980-03-13

申请号：DE2837590

申请日：1978-08-29

Applicant: IBM DEUTSCHLAND

Inventor： BOHLEN HARALD DIPL PHYS ,  ENGELKE HELMUT DIPL PHYS DR ,  GRESCHNER JOHANN DIPL PHYS DR ,  KULCKE WERNER DIPL PHYS DR ,  NEHMIZ PETER DIPL PHYS DR

IPC: H01L21/027 ,  H01J37/30 ,  H01J37/304 ,  H01L21/263 ,  H01L21/423

公开(公告)号：DE2137619A1

公开(公告)日：1973-02-08

申请号：DE2137619

申请日：1971-07-28

Applicant: IBM DEUTSCHLAND

Inventor： ENGELKE HELMUT DIPL PHYS DR ,  BOHLEN HARALD DIPL PHYS ,  LANDROCK JUERGEN

IPC: G01R31/02 ,  G01R31/306

Abstract: A non-contact method of testing the electrical continuity of a conductor line. At least one end of the conductor line is bombarded with a beam of electrons. A collector is positioned in spaced proximate relation to this end of the line to control the raising of the potential at this end to a particular level due to secondary emission. Current flows through the line which is measured to indicate the state of continuity in the line.