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公开(公告)号:DE2264030A1
公开(公告)日:1974-07-18
申请号:DE2264030
申请日:1972-12-29
Applicant: IBM DEUTSCHLAND
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公开(公告)号:DE3175044D1
公开(公告)日:1986-09-04
申请号:DE3175044
申请日:1981-10-30
Applicant: IBM DEUTSCHLAND , IBM
Inventor: ASCH KARL , GRESCHNER JOHANN DR , KALLMEYER MICHAEL , KULCKE WERNER DR
Abstract: A probe head arrangement for contacting a plurality of closely adjacent conductor lines 2 comprises a minimum of one probe head 3, where a plurality of fingers 4 together with a back 5 are made in one piece of monocrystalline silicon in semiconductor technique. A plurality of such probe heads 3 are composed to form a tester. At the beginning of each test it is determined which fingers 4 are to be, and are not to be placed onto the individual conductor lines 2 of a card 1 to be tested. Subsequently, the short and interruption tests can be implemented after the correlation of finger and probe head addresses with the conductor line addresses.
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