Semiconductor selective electrochemical etching equipment - giving two different anode potentials to allow control of etching rate and angle

    公开(公告)号:DE2951938A1

    公开(公告)日:1981-07-02

    申请号:DE2951938

    申请日:1979-12-22

    Abstract: Selective electrochemical etching equipment consists of a supply of current, a cathode, means for connecting the workpiece as anode and provision for covering the surface to be etched with electrolyte. The supply (7) and connections (5,6; 12,16,13,17) are arranged so that there are two potentials at the workpiece (1,10,20), one of which is at least as positive as and the other more positive than the cathode potential. The equipment is specified for use in etching semiconductor material, including intrinsic Si, p- and n-doped Si, Ge and GaAs. It is used in the determn. of depth of penetration and doping profiles and in the prodn. of oxide-filled insulating grooves and V-grooves for very dense packing of semiconductor elements. Planar surfaces, inclined at various angles to the original surface, can be produced and p- and n-doped material can be etched equally rapidly if suitable radiation is employed during etching.

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