公开(公告)号：US09326374B2

公开(公告)日：2016-04-26

申请号：US13967401

申请日：2013-08-15

Applicant: ICHIA TECHNOLOGIES,INC.

Inventor： Chien-Hwa Chiu ,  Chih-Min Chao ,  Peir-Rong Kuo ,  Chia-Hua Chiang ,  Chih-Cheng Hsiao ,  Feng-Ping Kuan ,  Ying-Wei Lee ,  Yung-Chang Juang

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H05K3/22 ,  H05K3/38 ,  H05K3/46 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K1/028 ,  H05K1/0393 ,  H05K3/20 ,  H05K3/22 ,  H05K3/386 ,  H05K3/426 ,  H05K3/465 ,  H05K3/4673 ,  H05K2201/0154 ,  Y10T428/24521 ,  Y10T428/265 ,  Y10T428/31678

Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

Abstract translation: 柔性电路板包括具有凹陷以限定至少隔室的聚酰亚胺层的基板。 隔室包括具有侧壁和底壁的内壁表面。 隔室用于容纳多层单元，其中多层单元包括形成在隔室壁上的粘附增强层，设置在粘附增强层上的第一导电层和形成在第一导电层上的第二导电层 层。 粘附增强层是钯。 第一导电层是镍。 基板由聚酰亚胺（PI）组成。