公开(公告)号：JP2013048017A

公开(公告)日：2013-03-07

申请号：JP2011185397

申请日：2011-08-28

Applicant: Imagineering Inc ,  イマジニアリング株式会社

Inventor： TSURUOKA RYOJI ,  IKEDA YUJI

IPC: H05H1/48

Abstract: PROBLEM TO BE SOLVED: To provide a plasma processing apparatus which enables plasma processing on a division surface of a narrow space in a plasma processing apparatus performing plasma processing on a target region of a workpiece.SOLUTION: A plasma processing apparatus includes: a power supply part 12 supplying electric power for generating discharge plasma P; and a pair of electrodes 16, 16 which the electric power is provided by the power supply part 12 and the discharge plasma P is generated therebetween. The pair of electrodes 16, 16 is provided so that the discharge plasma P traverses a target region 2 and contacts with the target region 2.

Abstract translation: 要解决的问题：提供一种等离子体处理装置，其能够对在工件的目标区域上进行等离子体处理的等离子体处理装置中的狭窄空间的分割表面进行等离子体处理。 解决方案：等离子体处理设备包括：供电部分12，用于产生用于产生放电等离子体P的电力; 并且在它们之间产生由电源部分12和放电等离子体P提供电力的一对电极16,16。 提供一对电极16,16，使得放电等离子体P穿过目标区域2并与目标区域2接触。版权所有（C）2013，JPO＆INPIT

公开(公告)号：EP2759827A4

公开(公告)日：2015-07-01

申请号：EP12832279

申请日：2012-09-10

Applicant: IMAGINEERING INC

Inventor： IKEDA YUJI ,  TSURUOKA RYOJI

IPC: G01N21/71 ,  G01N21/73 ,  H05H1/00 ,  H05H1/24

CPC classification number: G01N21/718 ,  G01J3/443 ,  G01N2201/06113 ,  G01N2201/08 ,  G01N2201/125