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公开(公告)号：US20210247232A1
公开(公告)日：2021-08-12
申请号：US17302217
申请日：2021-04-27
Applicant: IMEC
Inventor： Nicolaas Tack , Andy Lambrechts , Luc Haspeslagh
Abstract: A method for calibrating an image sensor begins by illuminating a portion of the image sensor with an input light spectrum, where the input light spectrum includes light of known wavelength and intensity. The method continues by sampling an output for each optical sensor of the image sensor, where each optical sensor is associated with one or more optical filters and where each optical filter being associated with a group of optical filters of a plurality of groups of optical filters. Each optical filter of a group of optical filters is configured to pass light in a different wavelength range and at least some optical filters in different groups of the plurality of groups of optical filters are configured to pass light in substantially a same wavelength range. The method then continues by comparing a sampled output for each optical sensor of the plurality of optical sensors with an expected output and generating a calibration factor for each of at least a subset of the plurality of optical sensors and storing the generated calibration factors in memory.
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公开(公告)号：US11029207B2
公开(公告)日：2021-06-08
申请号：US16814234
申请日：2020-03-10
Applicant: IMEC
Inventor： Nicolaas Tack , Andy Lambrechts , Luc Haspeslagh
Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.
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公开(公告)号：US20200278252A1
公开(公告)日：2020-09-03
申请号：US16814234
申请日：2020-03-10
Applicant: IMEC
Inventor： Nicolaas Tack , Andy Lambrechts , Luc Haspeslagh
Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.
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公开(公告)号：US10260945B2
公开(公告)日：2019-04-16
申请号：US15059715
申请日：2016-03-03
Applicant: IMEC
Inventor： Nicolaas Tack , Andy Lambrechts , Luc Haspeslagh
Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.
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公开(公告)号：US10139280B2
公开(公告)日：2018-11-27
申请号：US15059621
申请日：2016-03-03
Applicant: IMEC
Inventor： Nicolaas Tack , Andy Lambrechts , Luc Haspeslagh
Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.
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Patent Agency Ranking
公开(公告)号：US20230154914A1
公开(公告)日：2023-05-18
申请号：US18055763
申请日：2022-11-15
Applicant: IMEC VZW
Inventor： Gauri Karve , Yunlong Li , Luc Haspeslagh , Philippe Soussan , Deniz Sabuncuoglu Tezcan
CPC classification number: H01L25/50 , H01L21/561 , H01L21/568
Abstract: According to a preferred embodiment of the method of the invention, an assembly is produced comprising a temporary wafer and one or more tiles that are removably attached to the temporary wafer, preferably through a temporary adhesive layer. The tiles comprise a carrier portion and an active material portion. The active material portion is attached to the temporary carrier. The assembly further comprises a single continuous layer of the first material surrounding each of the one or more tiles. Then the back side of the carrier portions of the tiles and of the continuous layer of the first material are simultaneously planarized, and the planarized back sides of the tiles and of the continuous layer of the first material are bonded to a permanent carrier wafer, after which the temporary carrier wafer is removed. The method results in a hybrid wafer comprising a planar top layer formed of the material of the continuous layer with one or more islands embedded therein, the top layer of the islands being formed by the top layer of the active material portion of the one or more tiles.
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公开(公告)号：US20160252395A1
公开(公告)日：2016-09-01
申请号：US15059715
申请日：2016-03-03
Applicant: IMEC
Inventor： Klaas Tack , Andy Lambrechts , Luc Haspeslagh
CPC classification number: G01J3/2823 , G01J3/12 , G01J3/26 , G01J3/2803 , G01J2003/1226 , G01J2003/265 , G01J2003/2806 , G01J2003/2826 , H04N5/332 , H04N5/378
Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.
Abstract translation: 公开了一种用于成像系统的集成电路。 在一个方面，集成电路具有光学传感器阵列，与传感器集成的光学滤波器阵列，并被配置为将波长带传递到一个或多个传感器上，并且读出电路以从 传感器来表示图像。 不同的滤光器被配置为具有不同的厚度，以通过干涉传递不同波长的波段，并且允许检测波长谱。 读出电路可以使一个光学滤波器下的多个像素平行读出。 厚度可以在阵列之间非单调地变化。 读出或稍后的图像处理可能涉及波长之间的选择或插值，以进行频谱采样或移位，以补偿厚度误差。
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公开(公告)号：US11282702B2
公开(公告)日：2022-03-22
申请号：US17068785
申请日：2020-10-12
Applicant: IMEC VZW , KATHOLIEKE UNIVERSITEIT LEUVEN
Inventor： Philippe Soussan , Vasyl Motsnyi , Luc Haspeslagh , Stefano Guerrieri , Olga Syshchyk , Bernardette Kunert , Robert Langer
Abstract: The present invent provides a method comprising forming a first wafer comprising a first substrate of a group IV semiconductor, and a group III-V semiconductor device structure formed by selective area epitaxial growth on a surface portion of a front side of the first substrate. The method further comprises forming a second wafer comprising a second substrate of a group IV semiconductor, and a group IV semiconductor device structure formed on a front side of the second substrate, and bonding the first wafer to the second wafer with the front side of the first substrate facing the front side of the second wafer.
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公开(公告)号：US20190285474A1
公开(公告)日：2019-09-19
申请号：US16359911
申请日：2019-03-20
Applicant: IMEC
Inventor： Nicolaas Tack , Andy Lambrechts , Luc Haspeslagh
Abstract: An integrated circuit for an imaging system is disclosed. In one aspect, an integrated circuit has an array of optical sensors, an array of optical filters integrated with the sensors and configured to pass a band of wavelengths onto one or more of the sensors, and read out circuitry to read out pixel values from the sensors to represent an image. Different ones of the optical filters are configured to have a different thickness, to pass different bands of wavelengths by means of interference, and to allow detection of a spectrum of wavelengths. The read out circuitry can enable multiple pixels under one optical filter to be read out in parallel. The thicknesses may vary non-monotonically across the array. The read out, or later image processing, may involve selection or interpolation between wavelengths, to carry out spectral sampling or shifting, to compensate for thickness errors.
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公开(公告)号：US11733095B2
公开(公告)日：2023-08-22
申请号：US17302217
申请日：2021-04-27
Applicant: IMEC
Inventor： Nicolaas Tack , Andy Lambrechts , Luc Haspeslagh
CPC classification number: G01J3/2823 , G01J3/12 , G01J3/26 , G01J3/2803 , H04N23/11 , H04N25/75 , G01J2003/1226 , G01J2003/265 , G01J2003/2806 , G01J2003/2826
Abstract: A method for calibrating an image sensor begins by illuminating a portion of the image sensor with an input light spectrum, where the input light spectrum includes light of known wavelength and intensity. The method continues by sampling an output for each optical sensor of the image sensor, where each optical sensor is associated with one or more optical filters and where each optical filter being associated with a group of optical filters of a plurality of groups of optical filters. Each optical filter of a group of optical filters is configured to pass light in a different wavelength range and at least some optical filters in different groups of the plurality of groups of optical filters are configured to pass light in substantially a same wavelength range. The method then continues by comparing a sampled output for each optical sensor of the plurality of optical sensors with an expected output and generating a calibration factor for each of at least a subset of the plurality of optical sensors and storing the generated calibration factors in memory.
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