公开(公告)号：US20240112944A1

公开(公告)日：2024-04-04

申请号：US18474803

申请日：2023-09-26

Applicant: IMEC VZW

Inventor： Jakob Visker ,  Lan Peng ,  Serge Vanhaelemeersch ,  Aurelie Humbert ,  Chi Dang Thi Thuy ,  Evert Visker

IPC: H01L21/683 ,  B32B43/00 ,  H01L21/30

CPC classification number: H01L21/6836 ,  B32B43/006 ,  H01L21/30

Abstract: The present disclosure relates to a temporary wafer bonding process including the steps of: providing a wafer for back processing by laminating a plain protective film on a front surface of the wafer; providing a rigid carrier; bonding the rigid carrier to the plain protective film by the intermediate of a bonding material layer; processing a back surface of the wafer; and separating the rigid carrier and the plain protective film from the wafer.